Binder-Jet SOFC Interconnects With Dense Gas-Tight Sintering
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Solution Overview
Problem
Conventional powder metallurgy processes for manufacturing solid oxide fuel cell (SOFC) interconnects are costly due to high capital and operating expenses, and result in density variations and warping, requiring additional oxidation and grit blasting steps to achieve a dense, gas-tight interconnect.
Innovation Solution
The method involves binder jet printing a metal alloy powder or powder mixture to form a green interconnect, followed by debinding and pressureless sintering, eliminating the need for high-temperature oxidation and grit blasting, and allowing for the production of dense, chromium-iron alloy interconnects with improved thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional powder metallurgy processes are used to manufacture SOFC interconnects, then the manufacturing process is established and repeatable, but the production cost is high and density variations occur
Solution Approach 1:
The patent changes the manufacturing process parameters from conventional powder metallurgy to binder jet printing, which uses a different binding mechanism and sintering approach. This parameter change eliminates density variations while reducing production costs by eliminating oxidation and grit blasting steps.
Solution Approach 2:
The patent replaces the mechanical pressing and oxidation processes with binder jet printing and pressureless sintering. This substitution eliminates the need for high-temperature oxidation and grit blasting, reducing manufacturing complexity and cost while improving density uniformity.
2Ease of manufacture
If conventional powder metallurgy processes are used, then interconnects can be manufactured, but warping occurs and additional oxidation and grit blasting steps are required
Solution Approach 1:
The patent replaces conventional mechanical pressing and high-temperature oxidation with binder jet printing and pressureless sintering. This substitution eliminates warping and removes the need for oxidation and grit blasting steps, simplifying the manufacturing process.
Solution Approach 2:
The patent changes the sintering parameters from high-temperature oxidation to pressureless sintering, which prevents warping and eliminates the need for subsequent oxidation and grit blasting steps, thereby simplifying the overall manufacturing process.
3Manufacturing precision
If binder jet printing is used to form green interconnects, then density variations are eliminated, but debinding and sintering steps are required
Solution Approach 1:
The patent replaces conventional oxidation and grit blasting steps with binder jet printing followed by pressureless sintering. Although debinding is added, the elimination of oxidation and grit blasting results in a net reduction of process complexity while maintaining density uniformity.
4Use of energy by moving object
If binder jet printing is used, then thermal conductivity is enhanced, but production costs must be compared against conventional methods
Solution Approach 1:
The patent changes the manufacturing method to binder jet printing with pressureless sintering, which produces dense interconnects with enhanced thermal conductivity. The elimination of oxidation and grit blasting steps reduces production costs, making the enhanced thermal conductivity achievable at lower overall cost.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces production costs and eliminates density variations, enabling the production of dense, gas-tight interconnects with enhanced thermal conductivity and reduced warping, while simplifying the manufacturing process.
Implementation Method 1
binder jet printing a metal alloy powder or a metal powder mixture to form a green interconnect
Implementation Method 2
debinding the green interconnect
Implementation Method 3
sintering the green interconnect to form a metal alloy interconnect for an electrochemical stack
Data Source
Figure 1A~1B
Figure 2A~2B
Figure 2C~2D
AI summary
A method includes binder jet printing a metal alloy powder or a metal powder mixture to form a green interconnect, debinding the green interconnect, and sintering the green interconnect to form a metal alloy interconnect for an electrochemical stack.