Binder Resin for Low-Temperature Curing in Semiconductor Devices
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Solution Overview
Problem
The challenge is to develop a binder resin and positive-type photosensitive resin composition that excel in chemical resistance and mechanical properties while accommodating lower heat treatment temperatures, which is essential for modern semiconductor devices to reduce heat load on substrates without compromising performance.
Innovation Solution
A binder resin is formulated by polymerizing a compound with a specific chemical structure and an oxydiphthalic anhydride (ODPA) dianhydride, incorporating a urethane functional group, which is combined with other compounds to create a positive-type photosensitive resin composition that includes a photo active compound, cross-linking agent, surfactant, and solvent, resulting in an insulating film with enhanced properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a polyimide-based binder resin is used to achieve excellent mechanical properties and heat resistance, then the physical properties of the pattern and thin film are improved, but a high temperature heat treatment of 350°C or higher is required which increases heat load on the substrate
Solution Approach 1:
The patent changes the chemical structure parameters of the binder resin by introducing a specific polyimide precursor structure with formula (1) containing particular structural features that enable lower temperature curing. This structural parameter change allows the resin to achieve excellent mechanical properties and heat resistance at heat treatment temperatures of 220°C or lower, thereby reducing the heat load on substrates while maintaining required performance
Solution Approach 2:
The patent creates a composite photosensitive resin composition containing the specially designed polyimide precursor (formula 1), a photoinitiator, and other components that work synergistically. This composite formulation enables the system to achieve cross-linking and curing at lower temperatures while maintaining mechanical strength and chemical resistance, resolving the contradiction between property enhancement and temperature reduction
2Temperature
If a heat treatment of 220°C or lower is used to reduce heat load on substrate, then the heat load is reduced, but the physical properties of patterns and thin films deteriorate
Solution Approach 1:
The patent modifies the polyimide precursor structure to formula (1) with specific structural parameters that lower the glass transition temperature and curing temperature. This parameter change enables the material to undergo effective cross-linking and form a robust network structure at 220°C or lower, thereby maintaining excellent physical properties including mechanical strength, adhesion, and chemical resistance despite the reduced heat treatment temperature
Solution Approach 2:
The patent introduces specific local structural features in the polyimide precursor formula (1) that create localized reactive sites and functional groups optimized for low-temperature cross-linking. These local structural modifications ensure that the curing reaction proceeds efficiently at lower temperatures while producing a dense, mechanically strong network structure, thus preventing physical property deterioration
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resulting binder resin and photosensitive resin composition demonstrate excellent chemical resistance and mechanical properties, suitable for semiconductor devices, even with reduced heat treatment temperatures, ensuring effective pattern formation and increased sensitivity.
Implementation Method 1
a binder resin including a structure in which a compound of the following Chemical Formula 1 and a dianhydride compound are polymerized
Implementation Method 2
a positive-type photosensitive resin composition including: the binder resin; a photo active compound
Data Source
AI summary
The present specification relates to a binder resin, a photosensitive resin composition, an insulating film and a semiconductor device.