Display Binding Structure With Added Conductor for Etched Wiring Loss
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Solution Overview
Problem
In electrophoretic display devices, the side etching during the wet etching process reduces the width of signal wirings, leading to decreased contact area between signal wirings and binding terminals, increasing connection resistance and affecting signal transmission.
Innovation Solution
The display device incorporates an additional conductive portion below the binding connection portion, with one side surface protruding perpendicular to the signal wiring, allowing the binding electrode to connect to both the binding connection and additional conductive portions, thereby increasing the contact area and reducing resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If wet etching process is used to form signal wirings in binding area, then signal wiring can be formed, but side etching occurs reducing wiring width and contact area
Solution Approach 1:
The patent introduces an additional conductive portion extending in a direction perpendicular to the signal wiring extension direction, transforming a 2D contact problem into a 3D multi-layer contact structure. This dimensional change allows the binding electrode to contact both the binding connection portion and the additional conductive portion, compensating for width reduction caused by side etching.
Solution Approach 2:
The conductive structure is segmented into multiple functional parts: binding connection portion, additional conductive portion, and binding electrode. This segmentation allows each part to perform its specific function - the binding connection portion maintains signal transmission, while the additional conductive portion provides extra contact area to compensate for etching damage.
2Reliability
If via hole is formed to connect binding terminal and signal wiring, then electrical connection is achieved, but contact area is reduced due to decreased wiring width
Solution Approach 1:
The patent adds a vertical dimension to the contact structure by introducing the additional conductive portion that extends perpendicular to the signal wiring. This creates a multi-layer contact architecture where the binding electrode can establish electrical connection through multiple contact points, increasing total contact area despite reduced wiring width.
Solution Approach 2:
The patent merges the binding connection portion and additional conductive portion into a unified conductive system. Both portions work together to provide electrical connection, effectively combining their contact areas to compensate for the reduced width of individual components.
3Ease of manufacture
If via hole deviates from signal wiring due to process fluctuation, then misalignment occurs, but contact area further reduces increasing connection resistance
Solution Approach 1:
The additional conductive portion acts as a buffer or cushion against misalignment. By providing extra contact area in a perpendicular direction, it compensates for potential deviations in via hole positioning, ensuring reliable electrical connection even when process fluctuations cause misalignment.
Solution Approach 2:
The additional conductive portion serves multiple functions: it provides extra contact area, compensates for width reduction from side etching, and acts as a tolerance buffer against misalignment. This multi-functionality enhances the robustness of the electrical connection against various manufacturing variations.
Data Source
AI summary
The present disclosure discloses a display device, in which a binding connection portion is disposed on a side of an additional conductive portion away from a substrate, and a spacing layer includes an opening disposed at least above the binding connection portion. At least one side surface of the additional conductive portion protrudes from a side surface of the binding connection portion along a first direction, which is parallel to the substrate and perpendicular to an extension direction of the signal wiring. A binding electrode extends into the opening, and is connected to either the binding connection portion, or both of the binding connection portion and the additional conductive portion.