Binding Pad Side Insulation for Etching Protection
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Solution Overview
Problem
In display panel manufacturing, the need for a high screen ratio and narrow binding area is compromised by the use of protective structures on binding pads, which can lead to signal interference and damage during wet etching processes.
Innovation Solution
A display panel design featuring mutually insulated binding pads with a side surface covered by an inorganic first insulating layer, which prevents etching solution contact and maximizes the binding area by forming a concave structure on the side surface, allowing for comprehensive protection without occupying additional space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a protective structure is provided on the edge of the upper surface of the binding pad to prevent etching solution contact, then the binding pad is protected from damage during wet etching, but the binding area is reduced and the screen ratio is compromised
Solution Approach 1:
The protective function is moved from the upper surface (2D plane) to the side surface (vertical dimension) of the binding pad. The first insulating layer is formed on the side surface extending from the lower surface to partially cover the upper surface, protecting the binding pad during etching while maintaining the full binding area on the upper surface.
Solution Approach 2:
The first insulating layer made of inorganic material serves as an intermediary protective barrier between the etching solution and the binding pad. This intermediary layer prevents direct contact between the harmful etching solution and the metal binding pad, while being selectively removable to expose the binding pad for subsequent processes.
2Area of stationary object
If the binding pad is made wider to increase binding area, then more binding area is available, but the distance between binding pads is reduced causing signal interference
Solution Approach 1:
The first insulating layer is selectively formed on the side surface and partially on the upper surface of each binding pad, providing localized protection only where needed during etching processes. This localized protection allows the binding pad to maintain its full width and binding area without requiring additional protective structures that would occupy space or cause interference.
3Reliability
If a protective structure is added to protect the binding pad, then damage during etching is prevented, but the device complexity increases
Solution Approach 1:
The first insulating layer is integrated with the existing binding pad structure, forming a unified component rather than a separate protective structure. The insulating layer and binding pad are formed together through a combined process, simplifying the overall device structure while maintaining protection functionality.
Solution Approach 2:
The first insulating layer serves multiple functions: it protects the binding pad during wet etching processes, acts as a barrier layer, and can be selectively removed to expose the binding pad for subsequent bonding operations. This multi-functionality reduces the need for separate protective structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design ensures effective insulation and protection of binding pads during subsequent etching processes, maintaining a high screen ratio and preventing signal interference while maximizing the binding area and conductivity.
Implementation Method 1
a first insulating layer disposed on the side surface, wherein the first insulating layer is in contact with the side surface of the binding pad
Data Source
AI summary
The present disclosure provides a display panel and a fabricating method thereof. The display panel includes a substrate and a plurality of mutually insulated binding pads disposed on the substrate. Each binding pad includes an upper surface, a lower surface and a side surface. The upper surface and the lower surface are both parallel to a plane of the substrate, the side surface is located between the upper surface and the lower surface, and the side surface connects the upper surface with the lower surface. A first insulating layer is disposed on the side surface of the binding pad, the first insulating layer is in contact with the side surface of the binding pad and is made of an inorganic material. With such a configuration, the side surface of the binding pad will not be damaged by an etching process subsequent to fabrication of the binding pads.