Bio-based Pressure-Sensitive Adhesive Copolymer for Polar Substrate Bonding
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Solution Overview
Problem
Biobased raw materials for polyacrylate-based pressure sensitive adhesives (PSAs) have limited availability, making it challenging to formulate PSAs with good peel adhesion and shear strength, especially on polar substrates.
Innovation Solution
A pressure sensitive adhesive composition comprising a copolymer with 45-75 wt% of isoamyl acrylate, n-heptyl acrylate, or 2-octyl acrylate, 24-50 wt% of alkyl (meth)acrylate with 1-4 carbon atoms, and 0.5-10 wt% of acrylic acid, primarily produced from renewable sources, along with a peel adhesion-boosting resin, to enhance adhesive properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If biobased raw materials are used for polyacrylate-based PSAs, then environmental footprint is reduced, but availability of raw materials is limited and adhesive performance deteriorates
Solution Approach 1:
The patent uses composite materials by combining biobased monomers (isoamyl acrylate, n-heptyl acrylate, 2-octyl acrylate) with conventional monomers (methyl acrylate, ethyl acrylate, propyl acrylate, butyl acrylate) to create a copolymer that achieves both good adhesive performance and reduced environmental footprint. The specific composition range (45-75 wt% biobased monomers a), 24-50 wt% conventional monomers b), 0.5-10 wt% acrylic acid c)) optimizes the balance between performance and sustainability.
Solution Approach 2:
The patent applies parameter changes by precisely controlling the composition ratios of different monomers in the copolymer. By adjusting the weight percentages of biobased monomers (a), conventional monomers (b), and acrylic acid (c), the patent optimizes adhesive properties such as peel adhesion and shear strength while maintaining a high biobased content for reduced environmental footprint.
2Object-affected harmful factors
If higher proportion of biobased monomers is used, then environmental sustainability is improved, but adhesive performance on polar substrates deteriorates
Solution Approach 1:
The patent optimizes peel adhesion on polar substrates by controlling the content of biobased monomers (a) at 45-75 wt%, conventional monomers (b) at 24-50 wt%, and acrylic acid (c) at 0.5-10 wt%. The acrylic acid content specifically enhances adhesion to polar substrates while maintaining high biobased content for environmental sustainability.
Solution Approach 2:
The patent creates a composite copolymer system that combines biobased monomers for sustainability with acrylic acid for enhanced polar substrate adhesion. This composite approach allows achieving both environmental sustainability and reliable peel adhesion on polar substrates simultaneously.
3Reliability
If resin fraction is increased to improve adhesive properties, then bonding performance is improved, but formulation complexity increases
Solution Approach 1:
The patent simplifies formulation by establishing clear parameter ranges for monomer composition (45-75 wt% biobased monomers a), 24-50 wt% conventional monomers b), 0.5-10 wt% acrylic acid c)) that directly deliver improved bonding performance. This systematic parameter control reduces formulation complexity while enhancing adhesive properties.
Data Source
AI summary
Disclosed is a pressure-sensitive adhesive composition which exhibits good adhesive forces, in particular on polar adhesive substrates, and good shear strength, and a significant proportion of which can be produced from bio-based raw materials. The pressure-sensitive adhesive composition comprises: at least one copolymer which can be traced to a monomer composition comprising a) 45-75 wt. % of at least one monomer selected from i-amyl acrylate, n-heptyl acrylate, and 2-octyl acrylate, b) 24-50 wt. % of at least one alkyl (meth)acrylate, the alcohol component of which has 1 to 4 carbon atoms, and c) 0.5 to 10 wt. % of acrylic acid; and at least one adhesive force-enhancing resin. Also disclosed is an adhesive tape comprising a carrier material and the pressure-sensitive adhesive composition; and the use of the pressure-sensitive adhesive composition or the adhesive tape to produce adhesive bonds in electronic, optical and/or precision mechanical devices.
