Bio-Based Matte EMI Shielding Film With Porous Metal Adhesion
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Solution Overview
Problem
Existing polyimide films face challenges in achieving thin thickness, matte surface, and high mechanical and thermal performance, while electromagnetic interference shielding films with thick metal layers suffer from popcorn effects and adhesion issues.
Innovation Solution
A matte-type electromagnetic interference shielding film comprising bio-based components with a bio-based electrically conductive adhesive layer, plated or porous metal layer, and bio-based insulating layer, designed to enhance mechanical strength, thermal resistance, and electromagnetic shielding performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the thickness of polyimide film is reduced to 5-7.5 μm to achieve ultra-thin design, then the thickness requirement is met, but mechanical strength, processing operability, and ability to form matte surface deteriorate
Solution Approach 1:
The patent uses composite materials by combining polyimide resin with inorganic fillers (such as aluminum oxide, aluminum hydroxide, magnesium hydroxide) and bio-based components. This composite structure enhances the mechanical strength and thermal stability of the ultra-thin film while maintaining the desired thickness of 5-7.5 μm, resolving the contradiction between thinness and strength.
2Length of moving object
If the thickness of polyimide film is reduced to 5-7.5 μm to achieve ultra-thin design, then the thickness requirement is met, but the ability to form matte surface with gloss less than 25 GU deteriorates
Solution Approach 1:
The patent applies local quality by incorporating inorganic fillers and bio-based components specifically in the insulating layer to create a matte surface finish with gloss less than 25 GU. This localized modification of surface properties allows the ultra-thin film to achieve the desired matte appearance without compromising the overall thinness requirement.
3Object-affected harmful factors
If thick metal layer is used in electromagnetic interference shielding film to improve shielding performance, then shielding effectiveness is enhanced, but popcorn effects and adhesion issues occur
Solution Approach 1:
The patent employs porous materials by forming a porous metal layer through electroplating followed by etching or oxidation processes. This porous structure reduces the overall metal layer thickness while maintaining effective electromagnetic shielding through enhanced surface area and multiple reflection paths. The porosity also improves adhesion to the underlying polyimide substrate and eliminates popcorn effects by allowing stress relief during thermal processing.
4Quantity of substance
If recoverable regeneration raw materials are used to manufacture bio-based polyimide resin, then bio-based content is increased, but heat resistance and mechanical properties deteriorate
Solution Approach 1:
The patent uses composite materials by combining bio-based polyimide resin derived from recoverable regeneration raw materials with inorganic fillers and petrochemical-based components. This composite approach maintains high bio-based content while compensating for the insufficient heat resistance and mechanical properties through the reinforcing effect of inorganic fillers and the synergistic properties of the composite structure.
Data Source
AI summary
The present disclosure provides a matte-type electromagnetic interference shielding film including bio-based components, which includes a bio-based insulating layer, a bio-based adhesive layer, a metal layer, and a bio-based electrically conductive adhesive layer. The matte-type electromagnetic interference shielding film including the bio-based component of the present disclosure has a matte appearance and high bio-based content and has the advantages of good surface insulation, high surface hardness, good chemical resistance, high shielding performance, good adhesion strength, low transmission loss, high transmission quality, good operability, high heat resistance, and the inner electrically conductive adhesive layer with long shelf life and storage life. The present disclosure further provides a preparation method thereof.