Bio-Based Acoustic Backing for Easier Ultrasonic Sensor Assembly
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Solution Overview
Problem
The assembly process of acoustic absorbing materials in ultrasonic sensors using epoxy and tungsten powder is difficult and time-consuming, and tungsten settlement can cause electrical conductivity issues leading to signal attenuation.
Innovation Solution
A transducer assembly with a backing formed of a base material containing a bio-based additive, such as cellulose, dispersed within the base material, provides acoustic damping and is manufactured using additive manufacturing to improve assembly efficiency and reduce signal attenuation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If epoxy and tungsten powder mixture is used for acoustic absorption, then acoustic damping performance is improved, but assembly difficulty and time increase
Solution Approach 1:
The patent changes the material parameters by replacing traditional epoxy-tungsten powder mixture with a polyurethane-based foam material that has closed-cell structure. This material provides equivalent acoustic damping performance while eliminating the assembly difficulties associated with wet potting and curing processes.
Solution Approach 2:
The patent uses a composite foam material combining polyurethane base polymer with closed-cell structure to achieve both acoustic damping and ease of assembly. The foam's cellular structure provides acoustic absorption while the material itself serves as both the absorbing medium and the structural component.
2Reliability
If epoxy and tungsten powder mixture is used for acoustic absorption, then acoustic damping performance is improved, but assembly time increases
Solution Approach 1:
The patent changes the material from a two-component mixture (epoxy + tungsten powder) requiring mixing, potting, and curing to a pre-formed foam material that is ready to install. This parameter change reduces assembly time while maintaining acoustic damping performance.
Solution Approach 2:
The foam material is pre-formed with the acoustic absorption properties already integrated into its cellular structure before installation. This preliminary preparation eliminates the need for on-site mixing, potting, and curing operations, significantly reducing assembly time.
3Reliability
If tungsten powder is mixed with epoxy, then acoustic absorption is achieved, but electrical conductivity increases causing signal attenuation
Solution Approach 1:
The patent changes the material composition from conductive epoxy-tungsten powder mixture to non-conductive polyurethane foam. This parameter change maintains acoustic absorption capability while eliminating the electrical conductivity issue that causes signal attenuation.
Solution Approach 2:
The patent replaces the problematic tungsten powder mixture with an alternative foam material that achieves the same acoustic function without the harmful electrical conductivity side effect, effectively substituting a material with better overall properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The bio-based additive enhances acoustic damping, improving the ultrasonic sensor's performance by increasing bandwidth and reducing ringing, with at least 2 dB/mm of relative attenuation, and allows for precise fitting and easier assembly.
Implementation Method 1
The backing is an absorbing element that provides acoustic damping for the transducer
Implementation Method 2
Acoustic absorbing materials can be used to improve the performance of the ultrasonic sensor by damping portions of the ultrasonic wave
Data Source
AI summary
A transducer assembly includes a transducer emitting or receiving an ultrasonic wave and a backing adjacent to the transducer. The backing is an absorbing element that provides acoustic damping for the transducer. The backing is formed of a base material with a bio-based additive dispersed within the base material.