Bio Chip Package Structure With Through Hole Substrate
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Solution Overview
Problem
Conventional bio chip package structures face issues with corrosion of electrical connection elements due to strong alkali reactions, limiting the active reaction zone and leading to potential leakage and damage from water vapor penetration.
Innovation Solution
A bio chip package structure design where the active surface of the bio chip is exposed through a hole in the substrate, eliminating the need for wire bonding and ensuring the mold seals directly on the substrate, preventing leakage and enhancing the active area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonding is used to connect the bio chip and substrate, then electrical connection is achieved, but the electrical connection elements (pads and wires) are easily corroded by strong alkali reaction solution
Solution Approach 1:
The patent extracts the electrical connection elements (pads and wires) from the bio chip surface and relocates them to the substrate bottom surface. This separation removes the corrosion-prone elements from the alkaline reaction environment on the bio chip surface, thereby improving their corrosion resistance while maintaining electrical connectivity through the substrate thickness.
Solution Approach 2:
The electrical connection path is extended from the traditional planar surface connection to a three-dimensional configuration through the substrate thickness. By routing connection elements to the bottom surface of the substrate, the design utilizes the vertical dimension to separate functional zones, protecting electrical components from chemical corrosion while maintaining electrical functionality.
2Area of stationary object
If pads and wires are arranged on the surface of the substrate, then electrical connection is established, but the active area of the reaction zone is limited
Solution Approach 1:
The patent relocates electrical connection elements from the bio chip surface to the substrate bottom surface, utilizing the vertical dimension through substrate thickness. This spatial redistribution frees up the entire surface area of the bio chip for reaction purposes, maximizing the active area without compromising electrical connectivity.
Solution Approach 2:
The design segments the functional zones by separating electrical connection functions from biochemical reaction functions in different spatial locations. The bio chip surface is dedicated to reaction activities, while the substrate bottom surface handles electrical connections, allowing independent optimization of each function and maximizing the reaction zone area.
3Ease of manufacture
If the bio chip is arranged on the bottom surface of the substrate, then the mold can fix on the upper surface, but height difference between substrate and bio chip must be considered
Solution Approach 1:
The patent incorporates a mold support structure that is pre-formed on the substrate upper surface before bio chip assembly. This preliminary structural preparation creates a reference platform that compensates for height differences, enabling accurate positioning and fixation of the mold without requiring precise manual adjustment during assembly.
Solution Approach 2:
The mold support structure acts as an intermediary element between the substrate and the mold. It mediates the height difference by providing a standardized interface that ensures proper alignment and sealing, eliminating the need for direct precision alignment between the bio chip and mold while maintaining manufacturing accuracy.
4Ease of manufacture
If there is a gap between the mold and substrate upper surface, then assembly is simplified, but water vapor can penetrate into the substrate causing damage
Solution Approach 1:
The patent extracts the sealing function from the general assembly structure and implements it through a dedicated sealing layer between the mold and substrate. This separate sealing component fills any gaps and prevents water vapor penetration, addressing the harmful effect without complicating the overall assembly process.
Solution Approach 2:
The patent employs a sealing layer in the form of a thin film or flexible barrier between the mold and substrate. This thin film effectively blocks water vapor and liquid penetration while maintaining a simple assembly structure, preventing damage to the bio chip package without requiring complex sealing mechanisms.
Data Source
AI summary
A bio chip package structure is provided, which includes a substrate having a top surface and a bottom surface, and a through hole penetrating the top surface and bottom surface of the substrate; a bio chip having an active surface and a back surface, at least two sides on the active surface of the bio chip having a plurality of I/O pads respectively, and a plurality of biological probes is arranged in area between the plurality of I/O pads, and the active surface of the bio chip is set toward to align the through hole of the substrate; and a mold is arranged on the top surface of the substrate, the mold having an opening to align with the through hole of the substrate, so the plurality of biological probes exposed from the through hole of the substrate and the opening of the mold.