Biochip Protruding Part Prevents Solution Overflow
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Solution Overview
Problem
In typical biochips, the limited space for the solution to be tested often leads to overflow issues, especially when dealing with large quantities or errors in solution addition, which can cause cross-contamination between reaction regions.
Innovation Solution
The biochip design includes a substrate with a semiconductor layer having reaction regions, a dielectric layer with openings, a metal layer with a wall structure, and a protective layer with a protruding part that forms a third opening, allowing for increased solution volume without overflow and preventing cross-contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the reaction region size is increased to accommodate larger solution volumes, then the solution overflow problem is alleviated, but the biochip area occupied by each reaction region increases, reducing the number of reaction regions that can be disposed on the biochip
Solution Approach 1:
The invention transitions from a two-dimensional planar reaction region to a three-dimensional cavity structure by forming a recessed cavity in the substrate. This vertical dimensionality change allows the reaction region to accommodate larger solution volumes without increasing the horizontal footprint on the biochip, thereby resolving the contradiction between solution volume capacity and biochip area utilization
Solution Approach 2:
The reaction cavity is nested within the substrate structure, with multiple layers including the substrate, insulating layer, semiconductor layer, dielectric layer, and protective layer forming a nested configuration. This nesting approach maximizes the use of vertical space within the substrate thickness, enabling larger solution volumes without expanding the biochip's external dimensions
2Adaptability or versatility
If multiple reaction regions are disposed in the biochip to detect different biological materials simultaneously, then the detection capability is improved, but the risk of cross-contamination due to solution overflow between adjacent reaction regions increases
Solution Approach 1:
The biochip is segmented into multiple independent reaction cavities, each surrounded by isolation structures including sidewalls and protective layers. This segmentation creates physical barriers between adjacent reaction regions, preventing solution overflow from one cavity from contaminating neighboring cavities, thereby enabling multi-parameter detection without cross-contamination risks
Solution Approach 2:
Isolation structures such as dielectric layers and protective layers are introduced as intermediary elements between adjacent reaction cavities. These intermediary layers act as barriers that prevent direct contact between solutions in different reaction regions, eliminating the cross-contamination pathway while allowing multiple reactions to proceed simultaneously
3Device complexity
If the reaction region space is limited to maintain a compact biochip design, then the biochip integration density is improved, but solution overflow occurs when large quantities of solution are added
Solution Approach 1:
The reaction cavity design incorporates a dynamic overflow prevention mechanism where the cavity depth and opening area are optimized to accommodate variable solution volumes. The cavity structure allows the solution level to rise dynamically without overflowing, while the isolation structures provide a safety margin that maintains reliable containment even when solution addition errors occur
Data Source
AI summary
A biochip includes a substrate, an insulating layer, a semiconductor layer, a dielectric layer, a metal layer, and a protective layer. The semiconductor layer is disposed on the insulating layer and has a reaction region. The dielectric layer is disposed on the semiconductor layer and has a first opening. The metal layer is disposed on the dielectric layer and includes a source, a drain, and a wall structure. The wall structure surrounds the first opening, the source, and the drain. The protective layer is disposed on the metal layer and has a flat part, a protruding part, a second opening, and a third opening. The flat part surrounds and defines the second opening. The protruding part is disposed corresponding to the wall structure, and the protruding part surrounds and defines the third opening. The second opening connects the third opening and the first opening to expose the reaction region.