Biocompatible Ferrule Connection for Ceramic Implant Substrates
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Solution Overview
Problem
The challenge in forming reliable electrical connections between biocompatible materials used in implantable devices and external equipment is exacerbated by the toughness of via materials and the lack of biocompatible soldering options, leading to poor or non-functional connections and cleanliness issues due to welding-induced ablation and carbonization.
Innovation Solution
A biocompatible electrical connection method utilizing a ferrule with a concentric flange, platinum-iridium or stainless steel, and adhesives like platinum-gold ink to form a conductive path between the ferrule and a circuit pattern on a ceramic substrate, allowing for successful welding of wire leads without drilling through the substrate, ensuring a strong and clean connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If welding is used to form electrical connections at the vias, then electrical connection is formed, but ablation of the via material occurs resulting in poor or no electrical connection and carbonized soot that adversely affects cleanliness
Solution Approach 1:
The patent introduces a ferrule as an intermediary component between the via and the wire lead. The ferrule is inserted into the via and provides a surface for welding the wire lead, preventing direct welding on the via material. This mediator approach allows welding to proceed without ablating the via material, thus maintaining electrical connection reliability while eliminating the harmful ablation and soot generation.
2Ease of manufacture
If drilling vias to accept wire leads is performed, then electrical connection path is created, but difficulty arises due to the toughness of the via material
Solution Approach 1:
The patent applies preliminary action by pre-forming the ferrule component before insertion into the via. The ferrule is manufactured separately with the appropriate geometry and material properties, then inserted into the drilled via. This preliminary preparation of the ferrule allows the via drilling process to be performed on the ceramic substrate without requiring the via material itself to be easily drillable, as the ferrule serves as the receptacle for the wire lead.
3Reliability
If biocompatible materials are used for vias, then biocompatibility is maintained, but welding operation causes ablation resulting in poor connection and cleanliness issues
Solution Approach 1:
The ferrule acts as a mediator that is biocompatible and suitable for welding. By placing the ferrule inside the biocompatible via, the welding operation is performed on the ferrule material rather than the via material. This preserves the biocompatibility of the via while providing a welding-friendly surface on the ferrule, eliminating ablation and soot generation while maintaining electrical connection quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method provides a robust, biocompatible electrical connection that maintains the integrity of the implantable device's hermetic seal while enabling effective communication with external equipment, ensuring reliable mechanical and electrical connectivity.
Implementation Method 1
The first adhesive adheres a first surface of the concentric flange of the ferrule to a surface of the substrate
Implementation Method 2
The second adhesive fills an annular space between a hole in the substrate and the ferrule
Implementation Method 3
The first adhesive or the second adhesive forms a conductive path on the surface of the substrate between the ferrule and a circuit pattern on the substrate
Data Source
AI summary
A biocompatible electrical connection includes a substrate; a ferrule having a concentric flange at a first end of the ferrule; a first adhesive; and a second adhesive. The first adhesive adheres a first surface of the concentric flange of the ferrule to a surface of the substrate. The second adhesive fills an annular space between a hole in the substrate and the ferrule. The first adhesive or the second adhesive forms a conductive path on the surface of the substrate between the ferrule and a circuit pattern on the substrate.