Biocompatible Organic Inorganic Film Stack for Implantable Device Packaging
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Solution Overview
Problem
Conventional packaging methods for implantable medical devices are inadequate in preventing water and oxygen permeation, leading to reduced device lifespan and high costs, and struggle to accommodate high-density electronic components in small volumes.
Innovation Solution
A package comprising alternately stacked organic and inorganic film layers, with biocompatible parylene or polyimide resin films and Al2O3, SiO2, SiC, or TiO2 films, respectively, to extend water and oxygen permeation paths and enhance biocompatibility, along with optional polytetrafluoroethylene buffer layers for improved binding and protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional hard packaging (plastic, metal, ceramic, or silicon substrate) is used for implantable medical devices, then mechanical support and biocompatibility are provided, but water and oxygen permeation cannot be effectively prevented, leading to reduced device lifespan
Solution Approach 1:
The patent employs a composite packaging structure consisting of multiple layers including organic films (such as parylene or polyimide) and inorganic films (such as aluminum oxide or silicon oxide). This multi-material composite approach combines the advantages of each material type: organic films provide flexibility and biocompatibility, while inorganic films provide superior barrier properties against water and oxygen permeation, thereby resolving the contradiction between reliability and harmful factor prevention.
Solution Approach 2:
The patent utilizes thin film structures, particularly organic films like parylene and polyimide, which can be deposited as continuous, pinhole-free barriers. These flexible thin films conform to the device geometry and provide effective protection against water and oxygen penetration while maintaining the device's mechanical flexibility and biocompatibility, thus extending device lifespan.
2Volume of moving object
If conventional hard packaging is used, then mechanical support is provided, but the packaging volume cannot be reduced for high-density electronic devices
Solution Approach 1:
The patent employs flexible thin film packaging layers that can be conformally deposited over high-density electronic components. These thin films provide necessary protection while occupying minimal volume, enabling the packaging of high-density devices in small volumes. The flexibility of the film structure allows it to adapt to complex device geometries and high component density arrangements.
3Ease of manufacture
If conventional packaging methods are used, then manufacturing simplicity is maintained, but cost accounts for more than 30% of the implantable medical device
Solution Approach 1:
The patent changes the manufacturing parameters by using thin film deposition techniques (such as chemical vapor deposition or atomic layer deposition) to create ultra-thin barrier layers. This approach reduces material consumption significantly compared to conventional hard packaging, thereby reducing packaging cost while maintaining or improving protective performance. The process parameters are optimized to achieve pinhole-free films at minimal thickness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively isolates water and oxygen, prolongs device lifespan, reduces packaging volume, and supports high-density electronic devices, while ensuring biocompatibility and cost-effectiveness.
Implementation Method 1
water and oxygen permeation paths in the complex environment inside the body extend along interfaces of the organic/inorganic films, thus, the water and oxygen permeation paths are greatly extended
Data Source
AI summary
An implantable medical device having a package, including: a device body, and a package configured for packaging the device body. The package includes at least one organic film layer and at least one inorganic film layer that are stacked on one another. An innermost layer of the package is an organic film layer or an inorganic film layer, and an outermost layer of the package is an organic film layer or an inorganic film layer. Each organic film layer is a parylene film or polyimide resin film with biocompatibility, and each inorganic film layer is an inorganic film with biocompatibility. A method for packaging an implantable medical device is also provided.