Biocompatible Packaging with Sloped Side Walls
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Solution Overview
Problem
Conventional packaging methods for implantable chips in biomedical applications result in large, costly packages that cause tissue irritation and inflammation due to their size and material incompatibility, and often require individual packaging, which is time-consuming and expensive.
Innovation Solution
A method involving the use of stacked bio-compatible layers for encapsulation, with sloped side walls and double dicing techniques to reduce edge sharpness, allowing for simultaneous processing of multiple chips and minimizing tissue irritation, using techniques like dicing and laser cutting for sloped surface creation and plasma treatment for surface damage removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional 'big box' packaging is used for implantable chips, then bi-directional protection is achieved, but device size increases leading to larger incisions, extended wound healing time, and increased tissue irritation
Solution Approach 1:
The patent merges the chip and its packaging into a single integrated structure where the packaging layers are directly formed on the chip substrate. This eliminates the need for separate individual chip packaging and the outer 'big box' housing, achieving bi-directional protection while minimizing device size to be substantially the same as or only slightly larger than the original chip.
Solution Approach 2:
The packaging structure uses nested layers where multiple packaging layers are stacked directly on the chip, with each layer providing specific protective functions. The sloped side walls are nested within the packaging structure, and the entire packaged chip is then housed in a minimal outer housing, creating a compact nested arrangement that reduces overall device volume.
2Reliability
If conventional individual chip packaging is applied before mounting on PCB, then chip protection is achieved, but manufacturing time and costs increase
Solution Approach 1:
The patent combines the chip protection function with the final device packaging by forming packaging layers directly on the chip during the manufacturing process. This eliminates the separate individual packaging step that would otherwise be required, thereby protecting the chip while maintaining manufacturing efficiency.
Solution Approach 2:
The packaging layers are formed on the chip substrate during the chip manufacturing process itself, before the chip is mounted on the PCB. This preliminary packaging action protects the chip from contamination and damage during subsequent handling and assembly operations, eliminating the need for separate post-manufacturing packaging steps.
3Strength
If standard packaging materials are used for chip housing, then structural protection is achieved, but biocompatibility is compromised requiring additional packaging layers
Solution Approach 1:
The patent uses composite packaging structures with multiple layers having different properties. The packaging includes layers made of biocompatible materials such as medical-grade polymers, biocompatible metals, or ceramic materials that provide both structural protection and biocompatibility. This eliminates the need for additional outer housing to provide biocompatibility protection.
Solution Approach 2:
Different regions of the packaging structure use materials with locally optimized properties. The packaging layers in direct contact with the chip provide structural protection, while outer layers use biocompatible materials for tissue contact. This localized material selection achieves both structural integrity and biocompatibility without requiring excessive packaging thickness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method results in smaller, biocompatible packages with reduced tissue irritation, efficient production, and effective diffusion barriers, maintaining device functionality and reducing packaging costs and healing time.
Implementation Method 1
separating the component and a first part of the substrate from a second part of the substrate using at least one physical process inducing at least one sloped side wall on the first part of the substrate
Implementation Method 2
using techniques like dicing and laser cutting for sloped surface creation
Implementation Method 3
using techniques like dicing and laser cutting for sloped surface creation and plasma treatment for surface damage removal
Implementation Method 4
provided with a reliable diffusion barrier... providing a device encapsulation composed out of stacked layers fully encapsulating the device
Data Source
AI summary
A method is disclosed for packaging a device, e.g., for bio-medical applications. In one aspect, the method includes obtaining a component on a substrate and separating the component and a first part of the substrate from a second part of the substrate using at least one physical process inducing at least one sloped side wall on the first part of the substrate. The method also includes providing an encapsulation for the chip. The resulting packaged chip advantageously has a good step coverage resulting in a good hermeticity, less sharp edges resulting in a reduced risk of damaging or infection after implantation and has a relatively small packaged volume compared to conventional big box packaging techniques.