Biodegradable Die Assembly for Wet-Process Semiconductor Recycling

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Solution Overview

Problem

Conventional semiconductor packages are difficult to recycle and generate hazardous waste due to non-biodegradable molding compounds and interconnect materials, posing environmental and disposal challenges.

Innovation Solution

Utilization of biodegradable materials for semiconductor die assemblies that disintegrate in wet chemical processes, reducing environmental impact and enabling easy disassembly for recycling.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional non-biodegradable molding compounds and interconnect materials are used in semiconductor packages, then the structural integrity and reliability of the package is maintained, but the package becomes difficult to recycle and generates hazardous waste

Engineering Contradiction:

Improvestructural integrityVSAvoidrecyclability

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent changes the chemical composition parameters of the molding compound by incorporating biodegradable polymers (PLA, PHA, PBS, PCL) and natural fillers (cellulose, starch, chitosan) to replace conventional non-biodegradable materials. This parameter change enables the material to decompose under specific conditions while maintaining structural integrity during operation, thus resolving the contradiction between reliability and recyclability

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent creates composite molding compounds by combining biodegradable polymers with natural fillers and functional additives. These composite materials exhibit both the mechanical strength needed for package reliability and the biodegradability required for easy recycling, directly addressing the technical contradiction

Inventive Principle:

Principle #40Composite materials

2Reliability

If conventional interconnect materials are used in semiconductor packages, then the electrical connectivity and performance are maintained, but toxic by-products are generated during disposal

Engineering Contradiction:

Improveelectrical connectivityVSAvoidtoxic by-products

Core Design Contradiction:

ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The patent changes the material composition of interconnect structures by using biodegradable conductive materials such as plant-based conductive polymers and metal-organic frameworks. These materials maintain electrical connectivity during device operation but decompose into non-toxic substances when exposed to biodegradation conditions, eliminating toxic by-products from disposal

Inventive Principle:

Principle #35Parameter changes

3Object-affected harmful factors

If biodegradable materials are used in semiconductor die assemblies, then environmental impact is reduced and recycling is enabled, but the materials must disintegrate in wet chemical processes which may affect structural stability

Engineering Contradiction:

Improveenvironmental impactVSAvoidstructural stability

Core Design Contradiction:

Object-affected harmful factorsVSStability of the object's composition

Solution Approach 1:

The patent applies different material properties to different parts of the semiconductor package. The molding compound and interconnect materials are designed with biodegradable properties for environmental benefits, while the semiconductor dies themselves maintain their conventional stable structures. This local differentiation allows biodegradable materials to disintegrate in wet chemical processes without compromising the structural stability of the functional semiconductor components

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Facilitates the recycling of semiconductor components without generating toxic by-products, thereby minimizing electronic waste and promoting sustainable disposal practices.

Implementation Method 1

a biodegradable structure attached to a second side of the first semiconductor die. The biodegradable structure is configured to disintegrate in a wet process. The biodegradable structure includes a conductive material and an insulating material, both of which are biodegradable and disintegrate in the wet process

Methodology Applied

Scientific EffectBiodegradation: Decomposition (biological)

Data Source

PatentUS12564075B2Semiconductor die assemblies with decomposable materials and associated methods and systems

Publication Date: 2026.02.24 MICRON TECHNOLOGY INC

AI summary

Semiconductor die assemblies with decomposable materials, and associated methods and systems are disclosed. In an embodiment, a semiconductor die assembly includes a memory controller die carrying one or more memory dies attached to its first side. The semiconductor die assembly also includes a biodegradable structure attached to its second side opposite to the first side. The biodegradable structure includes a conductive material and an insulating material, both of which are biodegradable and disintegrate in a wet process. The biodegradable structure can be configured to couple the memory controller die with an interface die. In this manner, when the biodegradable structure disintegrates (e.g., dissolve) in the wet process, the memory controller carrying the memory dies can be separated from the interface die to reclaim the memory controller with the memory dies and the interface die.