Bio-Epoxy Resin Composition for Printed Circuit Boards
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Solution Overview
Problem
Current resin compositions for printed circuit boards face challenges in achieving low melt viscosity, excellent moldability, and desmear resistance due to high viscosity during melting and inadequate chemical resistance, particularly in desmear steps involving alkaline solutions.
Innovation Solution
A resin composition incorporating specific compounds such as alkenyl-substituted nadimide and maleimide compounds, along with a cyanic acid ester and inorganic fillers, is developed to reduce melt viscosity and enhance resin flow properties and desmear resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If epoxy resin and glass fiber are used as main components, then strength and reliability are improved, but green house gases are generated during production and disposal
Solution Approach 1:
The patent changes the chemical composition parameters by incorporating bio-based components (bio-epoxy resin, cellulose nanofiber) to replace conventional petroleum-based materials, thereby reducing the carbon footprint while maintaining structural integrity and strength requirements
Solution Approach 2:
The patent creates a composite material system combining bio-epoxy resin with cellulose nanofiber and silane-modified polyethylene terephthalate, leveraging the synergistic effects of biodegradable polymers and reinforcing fibers to achieve both environmental sustainability and mechanical strength
2Ease of manufacture
If wood plastic composite is used, then ease of processing is improved, but heat-resistant properties and strength deteriorate
Solution Approach 1:
The patent applies local quality enhancement by concentrating heat-resistant components (silane-modified polyethylene terephthalate, cellulose nanofiber) at the fiber-matrix interface and within the resin matrix, providing targeted thermal stability without compromising the overall processability of the composite material
Solution Approach 2:
The patent develops a multi-phase composite system where each component contributes specific properties: bio-epoxy resin provides processability, silane-modified polyethylene terephthalate provides heat resistance, and cellulose nanofiber provides reinforcement, achieving a balance between ease of processing and heat-resistant properties
3Reliability
If high-performance materials are used to maintain strength, then reliability is improved, but environmental impact worsens
Solution Approach 1:
The patent modifies the material parameters by using bio-based polymers with tailored molecular structures (cellulose nanofiber aspect ratio, silane grafting density) to achieve high strength and heat resistance from renewable resources, eliminating the need for petroleum-based high-performance materials
Solution Approach 2:
The patent converts the traditionally problematic combustion of epoxy resin into a beneficial feature by using bio-epoxy resin that produces non-toxic combustion products, transforming the harmful environmental impact of epoxy disposal into an environmentally friendly characteristic
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition achieves low melt viscosity, high moldability, and excellent desmear resistance, maintaining elastic modulus and heat resistance while improving the quality and productivity of printed circuit boards.
Implementation Method 1
it has gradually come to light by experimentation that high-performance thermoplastic resin fibers having a silane crosslinked structure are effective as reinforcing fibers for a matrix resin
Implementation Method 2
when a resin composition containing a bio-epoxy resin and a cellulose nanofiber is used, attention must be paid to moisture in the air or in the material itself
Implementation Method 3
Resin composition, prepreg, resin sheet, laminate plate, and printed wiring board
Data Source
AI summary
A resin composition containing a compound represented by the following general formula (a) or the following general formula (b), an alkenyl-substituted nadimide compound, and a maleimide compound: R-CH=CH-R' (a) wherein R represents a phenyl group which may have one or more of an alkyl group having 1 to 6 carbon atoms, an alkoxy group, a phenoxy group, a hydroxyl group or an amino group, a naphthyl group which may have one or more of an alkyl group having 1 to 6 carbon atoms, an alkoxy group, a phenoxy group, a hydroxyl group or an amino group, or a biphenyl group which may have one or more of an alkyl group having 1 to 6 carbon atoms, an alkoxy group, a phenoxy group, a hydroxyl group or an amino group, and R' represents a methyl group, a phenyl group, a naphthyl group, a biphenyl group, or a benzyl group, wherein each of the phenyl group, the naphthyl group, the biphenyl group and the benzyl group may have one or more alkyl groups having 1 to 6 carbon atoms, and wherein Ra represents a group represented by the following general formula (c), and a plurality of Rb moieties each independently represent a methyl group, a phenyl group, a naphthyl group, a biphenyl group, or a benzyl group, wherein each of the phenyl group, the naphthyl group, the biphenyl group and the benzyl group may have one or more alkyl groups having 1 to 6 carbon atoms: wherein each Rc independently represents a methylene group, an isopropylidene group, or a substituent represented by -CO-, -O-, -S- or >SO2, and n represents an integer of 0 to 5.