Biometric Chip Card Interconnect Layout Without PCB Failure
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Solution Overview
Problem
Existing chip cards with integrated biometric sensors face high costs and reliability issues due to the use of printed circuit boards (PCBs) for interconnecting multiple electronic modules, which are expensive and prone to electrical interconnection failures from repeated bending.
Innovation Solution
A chip card structure that eliminates the need for PCBs by using an insert with asymmetric conductor tracks, where connection tracks have a thickness equal to the machining tolerance plus a margin, ensuring electrical continuity and compensating for thickness differences between modules, allowing modules to be integrated without PCBs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If PCB is used to interconnect electronic modules, then manufacturing cost increases and reliability decreases, but ease of manufacture improves
Solution Approach 1:
The patent extracts and eliminates the PCB from the chip card structure, removing the source of reliability issues. The electronic modules are directly mounted on the card body without requiring a separate PCB substrate, thereby eliminating the complex interconnection problems associated with PCBs while maintaining manufacturing feasibility through direct mounting techniques
Solution Approach 2:
The patent merges the functions of the PCB and the card body by integrating the electronic module mounting directly into the card body structure. This consolidation eliminates the need for a separate PCB layer, reducing the number of components and interconnections while improving reliability and simplifying the overall manufacturing process
2Adaptability or versatility
If PCB is used to support multiple electronic modules, then manufacturing cost increases, but device functionality improves
Solution Approach 1:
The patent removes the PCB from the system, extracting the mounting function and transferring it directly to the card body. This eliminates the complex PCB interconnection structure while preserving the ability to integrate multiple electronic modules through direct mounting on the card body surface
Solution Approach 2:
The card body is designed to serve multiple functions: it acts as both the structural support and the mounting platform for electronic modules. This multi-functionality eliminates the need for a separate PCB, reducing device complexity while maintaining the adaptability to integrate various electronic modules
3Ease of manufacture
If PCB is used for interconnecting modules, then initial manufacturing is feasible, but long-term reliability deteriorates due to bending
Solution Approach 1:
The patent extracts the PCB that causes bending-related failures and eliminates it from the structure. By mounting electronic modules directly on the rigid card body, the system removes the flexible interconnection layer that is susceptible to bending damage, thereby improving long-term durability while maintaining ease of initial assembly
Solution Approach 2:
The patent performs preliminary mounting of electronic modules directly onto the card body in a fixed position, eliminating the need for flexible PCB interconnections that would later be subjected to bending stresses. This preliminary direct mounting action prevents future reliability issues by establishing rigid, stable connections from the outset
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing costs and enhances reliability by enabling effective interconnection of electronic modules within chip cards, maintaining compatibility with conventional manufacturing methods and ensuring electrical continuity despite varying module thicknesses.
Implementation Method 1
asymmetric conductor tracks, where connection tracks have a thickness equal to the machining tolerance plus a margin, ensuring electrical continuity
Data Source
AI summary
The invention relates to a portable communicating object (20) the operating mode of which is a contact or contactless mode, or a hybrid mode which is both contact and contactless, said object comprising a body (50) having external protective layers (15, 16) and an insert (40) placed between said protective layers, said insert (40) comprising a substrate (41) bearing a first electronic component (11; 60) having first connection pads (17) and further bearing at least a second electronic component taking the form of an electronic module (12) placed in a cavity (51) of the body (50), which cavity is obtained by machining, said electronic module (12) having second connection pads (18), and said insert (40) further comprising, on the one hand, interconnecting tracks (21, 22, 23, 24) intended to connect said first electronic component (11; 60) with said electronic module (12) so as to ensure electrical power is supplied thereto or data transferred therebetween, and on the other hand, connecting tracks (29) between said first electronic component (11; 60) and said interconnecting tracks (21, 22, 23, 24), characterized in that said connecting tracks (29) are located on the same side of the insert (40) as the electronic module (12) and in that they have a thickness at least equivalent to the absolute value of the machining tolerance (T) of said cavity (50).