Biometric Smart Card Insert With Thick Tracks for Tolerance Compensation
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Solution Overview
Problem
Existing smart cards with integrated biometric sensors face high costs and reliability issues due to the use of printed circuit boards (PCBs) for interconnecting multiple electronic modules, which require additional components and modifications to standard manufacturing processes, leading to increased expenses and potential electrical connection failures.
Innovation Solution
A smart card structure utilizing an asymmetrical insert with thin and thick conductive tracks on a polymer substrate, where the thick tracks compensate for machining tolerances and module thickness differences, eliminating the need for PCBs and ensuring reliable electrical connections between modules.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a printed circuit board (PCB) is used to interconnect electronic modules in smart cards, then the modules can be connected electrically, but the manufacturing cost increases and reliability decreases due to additional components and manufacturing modifications
Solution Approach 1:
The patent extracts and eliminates the PCB substrate from the smart card structure, removing the source of reliability issues and manufacturing complexity. The electronic modules are directly mounted on the card body with electrical connections established through conductive tracks formed directly on the card substrate, bypassing the need for a separate PCB interconnection layer.
Solution Approach 2:
The patent merges the functions of the PCB substrate and the card body into a single integrated structure. The card body itself serves as the mounting substrate for electronic modules and provides the conductive tracks for electrical interconnections, eliminating the need for a separate PCB and reducing overall device complexity.
2Ease of manufacture
If a printed circuit board (PCB) is used to interconnect electronic modules, then electrical connections can be established, but manufacturing costs increase due to additional components and process modifications
Solution Approach 1:
The PCB component is extracted and removed from the smart card assembly. The manufacturing process is simplified by directly forming conductive tracks on the card body substrate and mounting modules directly to it, eliminating the need for separate PCB fabrication, assembly, and integration steps.
Solution Approach 2:
The card body substrate is given multiple functions: it serves as the structural base of the card, the mounting platform for electronic modules, and the carrier of conductive tracks for electrical interconnections. This multi-functionality eliminates the need for a dedicated PCB and simplifies the overall manufacturing process.
3Manufacturing precision
If thin conductive tracks are used on the insert, then interconnection between modules is achieved, but the tracks are insufficient to compensate for machining tolerances and module thickness variations
Solution Approach 1:
The patent applies different track thicknesses at different locations on the insert. Thin tracks (10 µm) are used for interconnections where precision is less critical, while thick tracks (80 µm) are specifically applied at connection points to modules, providing local tolerance compensation where it is most needed without unnecessarily increasing overall track material usage.
Solution Approach 2:
The patent changes the thickness parameter of conductive tracks based on their functional requirements. By varying the track thickness from 10 µm to 80 µm depending on the connection point, the system achieves both cost-effectiveness and adequate tolerance compensation for machining variations and module thickness differences.
4Reliability
If thick conductive tracks are used to compensate for machining tolerances, then connection reliability improves, but manufacturing complexity and cost increase
Solution Approach 1:
Thick conductive tracks (80 µm) are applied locally only at the connection points to electronic modules where tolerance compensation is critical for reliable electrical connection. The remainder of the interconnection network uses standard thin tracks (10 µm), maintaining simplicity wherever thick tracks are not required for reliability.
Solution Approach 2:
The track thickness parameter is optimized based on functional requirements: thin tracks (10 µm) for general interconnections and thick tracks (80 µm) specifically at module connection points. This selective parameter change achieves reliable connections without unnecessarily complicating the overall track structure.
Data Source
Figure 1~2A
Figure 2B~2C
Figure 2D~2E
AI summary
The invention relates to a portable communicating object (20) the operating mode of which is a contact or contactless mode, or a hybrid mode which is both contact and contactless, said object comprising a body (50) having external protective layers (15, 16) and an insert (40) placed between said protective layers, said insert (40) comprising a substrate (41) bearing a first electronic component (11; 60) having first connection pads (17) and further bearing at least a second electronic component taking the form of an electronic module (12) placed in a cavity (51) of the body (50), which cavity is obtained by machining, said electronic module (12) having second connection pads (18), and said insert (40) further comprising, on the one hand, interconnecting tracks (21, 22, 23, 24) intended to connect said first electronic component (11; 60) with said electronic module (12) so as to ensure electrical power is supplied thereto or data transferred therebetween, and on the other hand, connecting tracks (29) between said first electronic component (11; 60) and said interconnecting tracks (21, 22, 23, 24), characterized in that said connecting tracks (29) are located on the same side of the insert (40) as the electronic module (12) and in that they have a thickness at least equivalent to the absolute value of the machining tolerance (T) of said cavity (50).