Biometric Sensor Carrier Tape for Smart Card Integration
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Solution Overview
Problem
The integration of fingerprint sensors in smart cards poses challenges due to cost constraints and the need for simplified manufacturing processes, as existing solutions do not efficiently accommodate low-profile, low-cost biometric imaging modules suitable for large-scale production.
Innovation Solution
A biometric imaging module manufacturing method involving a carrier tape with sensor and contact pad openings allows for a low-profile module configuration, using a non-conductive carrier tape and a glue layer to attach the biometric sensor, enabling reel-to-reel production and reduced module thickness, suitable for smart card integration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a biometric sensor is integrated into a smart card using conventional methods, then the sensor can be functional, but the manufacturing complexity and cost increase significantly
Solution Approach 1:
The invention divides the biometric sensor assembly into separate functional components: the sensor element, contact pads, and carrier tape. This segmentation allows each component to be manufactured independently using simple processes, then assembled together, reducing overall manufacturing complexity while maintaining functionality.
Solution Approach 2:
The carrier tape serves multiple functions simultaneously: it provides mechanical support for the biometric sensor, establishes electrical connections through integrated contact pads, and enables reel-to-reel manufacturing. This multi-functionality reduces the number of separate components needed, simplifying the overall device structure.
2Length of moving object
If the biometric sensor module is made thin for smart card integration, then it fits better in smart cards, but manufacturing becomes more difficult
Solution Approach 1:
The invention moves contact pads from the top surface to the backside of the carrier tape, utilizing the third dimension (depth/thickness) to resolve spatial conflicts. This allows the sensor to be thin while maintaining proper electrical connections, as contacts are accessed from the opposite side rather than requiring lateral space.
Solution Approach 2:
The biometric sensor is positioned within openings in the carrier tape, with contact pads nested on the opposite side. This nested configuration allows compact, thin-profile construction while maintaining all necessary functional elements within a small volume suitable for smart card integration.
3Productivity
If conventional smart card manufacturing methods are used, then existing processes can be maintained, but large-scale production efficiency is reduced
Solution Approach 1:
The carrier tape with integrated contact pads and sensor openings is designed to be self-aligning during assembly. The sensor automatically positions itself relative to the contact pads through the predefined opening geometry, eliminating the need for complex alignment procedures and enabling high-speed automated reel-to-reel manufacturing.
Solution Approach 2:
Contact pads and sensor openings are pre-formed in the carrier tape before sensor attachment. This preliminary preparation allows sensors to be quickly attached without requiring subsequent alignment or connection steps, significantly increasing production speed and enabling large-scale manufacturing.
4Manufacturing precision
If separate openings for sensor and contact pads are formed in the carrier tape, then manufacturing precision is improved, but the carrier tape design becomes more complex
Solution Approach 1:
The carrier tape integrates both sensor mounting openings and contact pad formations into a single unified structure. This merging of functions into one component simplifies the overall design while maintaining precise alignment, as both features are defined in the same carrier tape rather than requiring separate alignment steps between multiple components.
Data Source
Figure 1~2A
Figure 2B~2D
Figure 3A~3B
AI summary
Method for manufacturing a biometric imaging module, the method comprising: providing (100) a carrier tape (200); forming (104) a sensor opening (204) and at least one contact pad opening (206) in the carrier tape, wherein the sensor opening is adjacent to the contact pad opening; and from a top side of the carrier tape, arranging (106) a biometric sensor (212) on the carrier tape such that a body (214) of the biometric sensor is arranged in the sensor opening and a conductive contact pad (216) of the biometric sensor is aligned with and accessible through the contact pad opening from a backside of the carrier tape, and such that a sensing surface of the biometric sensor is facing in the same direction as the top side of the carrier tape.