Side-Protrusion Biometric Recognition Module for Slim Wearables
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Solution Overview
Problem
Wearable electronic devices face challenges in accurately measuring biometric information due to the positioning of sensors, as front glass thickness affects performance and maintaining slimness is difficult with rear plate stacking.
Innovation Solution
The electronic device incorporates a protrusion from the side surface with windows for biometric sensors, allowing accurate measurement while maintaining a slim design by separating sensors from the display area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If sensors are mounted in the front of the wearable electronic device, then biometric information can be measured, but the front glass thickness deteriorates measurement performance
Solution Approach 1:
The sensor module is extracted from the front surface of the wearable electronic device and relocated to a protrusion extending from the side surface. This extraction removes the sensor from the problematic front glass environment, allowing accurate biometric measurement without being constrained by front glass thickness.
Solution Approach 2:
The sensor module is relocated from the front surface (two-dimensional plane) to a protrusion extending in the lateral dimension (third dimension). This dimensional transition allows the sensor to be positioned away from the front glass while maintaining a compact overall device structure.
2Measurement precision
If sensors are stacked adjacent to the rear plate of the wearable device, then biometric measurement is enabled, but the device thickness increases
Solution Approach 1:
The sensor module is extracted from the rear plate stacking arrangement and repositioned in a protrusion. This extraction eliminates the need to increase device thickness to accommodate sensors near the rear plate, as the protrusion utilizes lateral space instead.
Solution Approach 2:
Instead of stacking sensors in the thickness direction (vertical dimension), the sensor module is positioned in a protrusion extending in the lateral dimension. This dimensional change allows sensor accommodation without increasing device thickness.
3Strength
If the front glass is made thick for sturdiness, then structural strength is improved, but sensor performance deteriorates
Solution Approach 1:
The sensor module is extracted from the front surface area, removing it from the region affected by front glass interference. This allows the front glass to be optimized for strength without compromising sensor performance, as the sensor no longer requires direct interaction with the front glass.
Data Source
AI summary
According to certain embodiments, an electronic device comprises: a housing; a protrusion from a side surface of the housing including a first window and a second window; a first board disposed inside the housing; a second board connected to one surface of the first board; a first sensor circuit mounted on a first surface of the second board, disposed in the protrusion, and spaced apart from and under the first window; and a second sensor circuit mounted on a second surface of the second board facing in a direction opposite to the first surface of the second board, disposed in the protrusion, and spaced apart from and above the second window.