Bionic Laminated Thermal Insulation Material for High-Temperature Applications
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Solution Overview
Problem
Current high-temperature thermal insulation materials are inadequate for industrial applications due to high energy consumption and limitations in thinness, longevity, and environmental friendliness, with existing laminated structures being unsuitable for high-temperature conditions.
Innovation Solution
A bionic laminated thermal insulation material is developed, mimicking the structure of Sequoia sempervirens bark, using low thermal conductivity microporous powder, reinforcing agents, and a binder to create multi-layered units with improved thermal insulation and refractory properties, reducing heat conduction and thickness while increasing service life and cost-effectiveness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If traditional thermal insulation materials (lightweight bricks, refractory fiber) are used, then thermal insulation function is provided, but energy consumption remains high and thickness cannot be reduced
Solution Approach 1:
The patent uses composite materials by combining microporous powder (low thermal conductivity) with binder and reinforcing agent to create a laminated structure. This composite approach achieves superior thermal insulation performance with reduced thickness compared to traditional single-material insulation layers.
Solution Approach 2:
The patent employs microporous powder as the main raw material, utilizing the porous structure to trap air and reduce thermal conductivity. The microporous structure significantly lowers heat transfer through the insulation material, enabling thinner insulation layers with equivalent or better performance.
2Loss of energy
If existing laminated structures (aluminum film reflective layer) are used, then thermal insulation efficiency is improved, but applicability is limited to low temperature fields only
Solution Approach 1:
The patent changes the material parameters by selecting microporous powder with appropriate particle size, composition, and porosity that can withstand high temperatures. This parameter optimization enables the insulation material to function effectively in high-temperature industrial environments (up to 1000°C) rather than being limited to low-temperature applications.
Solution Approach 2:
The patent creates a composite material system where microporous powder provides thermal insulation, binder ensures structural integrity at high temperatures, and reinforcing agent enhances mechanical strength. This composite approach achieves both high-temperature resistance and effective thermal insulation.
3Loss of energy
If vacuum thermal insulation material is used, then thermal conductivity is reduced and vacuum structure is maintained, but preparation is limited by encapsulation material requirements
Solution Approach 1:
The patent uses microporous powder to create an open-cell porous structure that provides thermal insulation without requiring vacuum conditions. This eliminates the complex vacuum encapsulation process while achieving comparable or superior insulation performance through the inherent low thermal conductivity of the porous structure.
Solution Approach 2:
The patent develops a composite material formulation where microporous powder, binder, and reinforcing agent work together to create a structurally stable insulation material that does not require vacuum encapsulation. This simplifies the manufacturing process while maintaining effective thermal insulation.
4Length of stationary object
If insulation material thickness is reduced, then energy saving and thinness requirements are met, but mechanical strength and service life are compromised
Solution Approach 1:
The patent uses composite materials where microporous powder provides insulation, binder ensures structural cohesion, and reinforcing agent enhances mechanical strength. This composite structure maintains high mechanical properties even at reduced thickness, ensuring long service life and reliability.
Solution Approach 2:
The patent applies local quality by optimizing the distribution and composition of microporous powder, binder, and reinforcing agent within the insulation layer. This localized optimization ensures that each component performs its specific function, resulting in a thin yet mechanically robust insulation material with extended service life.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The bionic laminated material achieves significantly reduced thermal conductivity (0.02-0.05 W/m·k) and extended service life, with improved toughness and bonding strength, suitable for high-temperature applications up to 1000°C, offering a cost-effective and environmentally friendly solution for industrial insulation.
Implementation Method 1
low thermal conductivity microporous powder
Implementation Method 2
microporous powder as main raw material
Data Source
AI summary
The invention discloses a bionic laminated thermal insulation material, which imitates a multi-thin laminated and thin-layer micro-pore structure of Sequoia sempervirens bark with fire resistance, corrosion resistance and excellent thermal insulation performance. A low thermal conductivity microporous powder is used as main raw material, while reinforcing agent, plasticizer and porosity agent are added to form microporous thin-layer units, and each thin-layer unit is bonded and laminated to make a laminated thermal insulation material. The thermal conductivity of the finished products is as low as 0.02˜0.05 W/m·k, with good thermal insulation and mechanical properties, which can be used in a temperature range below 1000° C., with better thermal insulation and energy-saving effect and toughness than ordinary thermal insulation materials, significantly reducing the thickness of the insulation layer, and can be widely used in industrial furnaces, thermal engineering devices, insulation pipes and other fields.