Biosensor Insertion Device With Automatic Adhesive Release
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Solution Overview
Problem
Existing insertion devices for continuous glucose monitors (CGMs) are cumbersome and require lengthy implementation times, complicating assembly and production processes, and there is a need for improved convenience and efficiency in sensor installation.
Innovation Solution
An insertion device comprising a cover assembly, implant module, patch base, sensor assembly, and peel-off component, which includes a removable outer shell, adhesive pad, and peel-off mechanism to facilitate easy implantation and extraction of a needle, ensuring quick and secure attachment to the skin.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of time
If conventional insertion devices are used for CGM implantation, then sensor implantation can be achieved, but the implementation time is lengthy and assembly is complicated
Solution Approach 1:
The patent combines the outer release layer removal function with the bottom cover removal action. When the bottom cover is removed from the outer shell, the peel-off component automatically removes the outer release layer from the adhesive pad through mechanical connection between these components. This merging of functions eliminates separate steps and reduces overall implementation time while simplifying the assembly process.
Solution Approach 2:
The outer release layer is pre-positioned on the adhesive pad during manufacturing, and the peel-off component is pre-configured to automatically remove it upon bottom cover removal. This preliminary arrangement ensures that the release layer removal occurs as an integrated part of the device activation process rather than requiring separate manual intervention, thereby reducing implementation time and simplifying user operation.
2Reliability
If the outer release layer is firmly attached to the adhesive pad, then secure attachment is ensured, but removal becomes difficult
Solution Approach 1:
The peel-off component acts as an intermediary between the bottom cover and the outer release layer. It provides a mechanical leverage point that enables easy removal of the firmly attached release layer by translating the user's pulling force on the bottom cover into effective force for releasing the adhesive bond, thus maintaining both secure attachment during storage and ease of removal during activation.
Solution Approach 2:
The system transitions from a static firmly-attached state to a dynamic removal process. The peel-off component is designed to remain engaged with the outer release layer during normal conditions, maintaining secure attachment. When the user pulls the bottom cover, the dynamic interaction between the peel-off component and the release layer enables controlled and easy removal through mechanical advantage.
Data Source
AI summary
An insertion device includes a cover assembly, an implant module, a patch base, a sensor assembly, and a peel-off component. The cover assembly includes an outer shell and a bottom cover. The outer shell defines an accommodating space. The implant module is disposed in the accommodating space and is operable for implanting and extracting a needle. The patch base includes a base body, an adhesive pad that is connected fixedly to the base body, and an outer release layer that is attached detachably to the adhesive pad. The sensor assembly is connected to the base body when the needle is implanted by the implant module. The peel-off component is connected to the bottom cover and the outer release layer. The peel-off component removes the outer release layer from the adhesive pad when the bottom cover is separated from the outer shell.