Biosensor Cartridge Assembly for Low-Heat Chip Connection

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Solution Overview

Problem

Conventional biosensors face issues such as inaccurate color-based target material detection, susceptibility to short circuits, protein denaturation due to high-temperature soldering, and high manufacturing costs, along with the need for expensive and bulky measurement devices with poor reproducibility.

Innovation Solution

A biosensor cartridge with a sensor chip and circuit board connected via a connecting member for physical and electrical coupling, housed in a cartridge structure that minimizes chip damage and optimizes specimen containment, using a connection terminal for secure attachment to a diagnostic device without soldering, and a reinforced design to prevent leakage and enhance rigidity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If wire bonding is performed after activation of the biosensor chip, then electrical connection is achieved, but protein denaturation occurs due to high-temperature soldering

Engineering Contradiction:
Improvebiosensor functionalityVSAvoidprotein denaturation
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent performs wire bonding before activating the biosensor chip, rather than after. This preliminary action allows the electrical connection to be established while the chip is still in its manufacturing state, avoiding the high-temperature soldering process that would denature the protein-based reactants if performed after activation.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent changes the temperature parameter of the connection process by using wire bonding instead of soldering. Wire bonding operates at lower temperatures that do not cause protein denaturation, thereby maintaining the biological functionality of the activated chip while still achieving reliable electrical connection.

Inventive Principle:
Principle #35Parameter changes

2Ease of operation

If the electrode is formed by expansion to extend from the sensor unit, then connection to measurement device is facilitated, but the sensor chip size increases reducing chip yield

Engineering Contradiction:
Improveconnection easeVSAvoidchip yield
Core Design Contradiction:
Ease of operationVSProductivity

Solution Approach 1:

The patent uses wire bonding to establish electrical connections in a different dimensional approach - rather than expanding the electrode area on the chip surface, thin wires are bonded vertically or at angles from existing pad electrodes, achieving connection without increasing the chip's planar footprint.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Reliability

If direct contact between biosensor chip and measurement device is used, then signal transmission is direct, but external force causes cracks in the chip

Engineering Contradiction:
Improvesignal transmissionVSAvoidchip structural integrity
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The patent introduces a circuit board as an intermediary component between the biosensor chip and the measurement device. The chip is mounted on the circuit board, which provides mechanical support and distributes external forces, preventing direct transmission of stress to the fragile chip while still enabling signal transmission through the board's electrical traces.

Inventive Principle:
Principle #24Intermediary (Mediator)

4Ease of operation

If conventional color development method is used for target material detection, then simple visual determination is possible, but detection accuracy varies by user

Engineering Contradiction:
Improvedetection simplicityVSAvoiddetection accuracy
Core Design Contradiction:
Ease of operationVSMeasurement precision

Solution Approach 1:

The patent replaces the mechanical/visual detection system with an electrical detection system. Instead of relying on human visual interpretation of color changes, the system uses electrical signals generated by the biosensor to detect target materials, eliminating user-dependent variability while maintaining ease of operation through automated electronic readout.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution reduces sensor chip defects, improves reliability, and enables accurate, cost-effective, and portable biosensor systems for rapid disease diagnosis with enhanced reproducibility and reduced manufacturing costs.

Implementation Method 1

the target material is combined (e.g., disposed) in a channel, if an electrochemical reaction occurs or the target material itself has a charge, electrons or holes in the semiconductor structure are accumulated or depleted due to the electric field effect

Methodology Applied
Scientific EffectElectrochemical reaction: Redox Reactions

Implementation Method 2

a plurality of connecting members performing one-to-one connection of connection pads of the circuit board to the source pad, the drain pad, and the gate pad of the sensor chip

Methodology Applied
Scientific EffectElastic contact: Elasticity

Data Source

PatentUS20230333100A1Biosensor cartridges and biosensor system having the same
Publication Date: 2023.10.19 LG ELECTRONICS INC
  • US20230333100A1 patent drawing
  • US20230333100A1 patent drawing
  • US20230333100A1 patent drawing

AI summary

The present disclosure provides a biosensor cartridge comprising a circuit board including a connection terminal configured to be electrically connectable to an external diagnostic device; a sensor chip configured to detect a target material from an applied analysis specimen and transmit an electrical signal generated by reacting with the detected target material to the connection terminal of the circuit board; and a housing configured to accommodate the circuit board and the sensor chip and surround the circuit board and the sensor chip so that the connection terminal is exposed, and an accommodating portion accommodates the analysis specimen and opens the sensor chip's sensor area in which a reactant reacting specifically with the target material is disposed is formed on one surface of the housing. cancan