Biosensor Cartridge Probe Pin Alignment for Miniaturized Sensor Chips
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Solution Overview
Problem
Existing biosensors face challenges in miniaturization due to the size of the sensor chip and the need for large test equipment, which limits their accuracy and efficiency in detecting target materials in biological specimens.
Innovation Solution
A biosensor cartridge system that includes a sensor chip and a separate probe device, allowing for direct testing of the sensor chip with a circuit board without the need for a separate board, and featuring a po-go pin configuration for flexible electrical connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the sensor chip is miniaturized, then the chip yield increases and the device becomes more compact, but the test equipment becomes difficult to operate and connection reliability decreases
Solution Approach 1:
The device is divided into three separate housing portions (first, second, and third housings) that can be assembled around the sensor chip. This segmentation allows the test equipment to accommodate miniaturized chips while maintaining stable connections through modular assembly structures.
Solution Approach 2:
The third housing portion acts as an intermediary component that simultaneously connects to both the first and second housings, providing a stable connection interface for the sensor chip pads. This intermediary structure ensures reliable electrical connections even when the chip is miniaturized.
2Productivity
If the sensor chip area is reduced, then more chips can be diced from a single wafer, but the pads become harder to access and connect
Solution Approach 1:
The housing portions are configured to access the sensor chip pads from different spatial dimensions and angles. The first, second, and third housings approach the chip from different directions, making it easier to connect to pads on miniaturized chips without requiring large chip area.
Solution Approach 2:
Each housing portion is specifically designed with local structural features optimized for accessing and connecting to specific pads on the sensor chip. This localized design ensures that even small chips have adequate pad accessibility for reliable connection.
3Ease of operation
If the electrode is extended to form a connection portion, then the sensor can be connected to measuring equipment, but the sensor chip size increases reducing wafer yield
Solution Approach 1:
The connection function is extracted from the sensor chip itself and implemented through separate housing portions that provide the connection interface. This allows the sensor chip to remain small for high wafer yield while the external housing structures provide the necessary connection capabilities to measuring equipment.
Solution Approach 2:
The housing portions serve multiple functions: they protect the sensor chip, provide mechanical support, enable connection to measuring equipment, and facilitate handling. This multi-functionality eliminates the need for extended electrodes on the chip itself, maintaining small chip size for high yield.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient miniaturization of the sensor chip, reduces the need for large test equipment, and improves accuracy by allowing simultaneous connection of multiple probe terminals to the sensor chip's pads, thereby enhancing the testing process.
Implementation Method 1
electrons or holes in the semiconductor structure are accumulated or depleted due to the electric field effect caused by the combination of the probe material and the target material
Implementation Method 2
if an electrochemical reaction occurs or the target material itself has a charge
Data Source
AI summary
Provided is a probe device for testing a sensor chip that detects a target material from an analysis specimen, has a reactant reacting specifically with the target material, and transmits a generated electrical signal through a pad. The probe device can include a lower housing accommodating a circuit board electrically connectable to an external test device; a middle housing positioned on the lower housing, coupled to the lower housing, and having the sensor chip mounted thereon; a probe module having probe pins for connecting a pad of the sensor chip and a connection pad of the circuit board to each other; and an upper housing positioned on the middle housing, coupled to the middle housing, having a recessed portion that opens the sensor chip, and having a guide area for aligning the probe module on the pads of the sensor chip and the circuit board.