Optical Biosensor Chip Signal Enhancement for Compact Detection
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Solution Overview
Problem
Optical biosensor devices are typically large and bulky, limiting their portability and requiring integration into a system-on-chip (SOC) for improved performance.
Innovation Solution
Integration of a bioreaction device with an image sensor in a small form factor integrated chip, incorporating an optical signal enhancement structure between the receptor layer and photodetector, which includes elements like a dielectric structure, micro-lens, and optical signal enhancement layers to enhance sensor optical radiation signals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If optical biosensor devices are made large and bulky, then performance and detection capability are improved, but portability deteriorates
Solution Approach 1:
The patent merges the optical biosensor components (receptor layer, photodetector, optical signal enhancement structure) into a single integrated chip architecture. This integration combines multiple functional elements that would traditionally be separate devices into one compact unit, maintaining detection capability while dramatically reducing device volume and improving portability.
Solution Approach 2:
The patent implements a nested structure where the photodetector is positioned directly beneath the receptor layer, with the optical signal enhancement structure nested between them. This nested arrangement allows compact stacking of functional layers, enabling high-performance detection within a small footprint and facilitating portable device design.
2Volume of moving object
If integration into system-on-chip is implemented, then device size is reduced, but manufacturing complexity increases
Solution Approach 1:
The patent segments the integrated chip into distinct functional layers: a receptor layer for bioreceptor immobilization, a photodetector layer for optical signal detection, and an optical signal enhancement structure layer. This segmentation allows each component to be optimized independently while maintaining overall integration, simplifying the manufacturing process despite the compact design.
3Illumination intensity
If optical signal enhancement structure is added, then signal intensity is improved, but device complexity increases
Solution Approach 1:
The patent introduces an optical signal enhancement structure as an intermediary element positioned between the receptor layer and the photodetector. This intermediary structure enhances the optical signal intensity through its optical properties (such as light concentration or amplification) without requiring complex additional components, thereby improving signal detection while maintaining reasonable structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integration reduces device size, enhances portability, and improves performance by increasing signal intensity and reducing noise, thereby improving sensitivity and accuracy.
Implementation Method 1
an optical signal enhancement structure disposed between the receptor layer and the photodetector
Implementation Method 2
A micro-lens is disposed over the color filter
Implementation Method 3
A photodetector is disposed within the semiconductor layer
Data Source
AI summary
The present disclosure relates to an integrated chip including a semiconductor layer and a photodetector disposed along the semiconductor layer. A color filter is over the photodetector. A micro-lens is over the color filter. A dielectric structure comprising one or more dielectric layers is over the micro-lens. A receptor layer is over the dielectric structure. An optical signal enhancement structure is disposed along the dielectric structure and between the receptor layer and the micro-lens.