Biosensor Electrode Krypton Sputtering Thin Film
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Solution Overview
Problem
Existing biosensor electrodes face challenges in reducing the amount of precious metals used without compromising conductivity and other material properties, especially at low thicknesses where conductive layers behave differently.
Innovation Solution
A biosensor electrode with a conductive layer composed of krypton and a conductive material like aluminum or silver, sputtered onto a polymeric film substrate, achieving a thickness of no greater than 150 nanometers with improved conductivity, abrasion resistance, adhesion, and corrosion resistance through a unique sputtering process that incorporates krypton as the sputtering gas.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the thickness of the conductive layer is reduced to decrease precious metal usage, then the amount of precious metal material is reduced, but the conductivity and other material properties deteriorate
Solution Approach 1:
The patent applies parameter changes by utilizing a specific sputtering gas composition (at least 50 volume% krypton) to fundamentally alter the deposition process parameters. This changes the physical and chemical state of the conductive layer formation, enabling thin films to achieve superior electrical properties that would be impossible with conventional sputtering methods. The krypton-based sputtering process modifies the energy distribution and penetration depth of ions, creating a denser, more conductive film structure at reduced thicknesses.
Solution Approach 2:
The patent creates a composite structure by incorporating krypton atoms within the conductive layer matrix during sputtering. This results in a composite material system where the conductive material (e.g., gold, silver, copper) is interspersed with krypton atoms, forming a unique microstructure that enhances electrical conductivity while maintaining mechanical integrity. This composite approach allows the thin film to achieve bulk-like conductivity properties at nanometer-scale thicknesses.
2Quantity of substance
If the thickness of the conductive layer is reduced below 100 nanometers, then the amount of material is reduced, but the material properties become unpredictable and difficult to control
Solution Approach 1:
The patent establishes precise control over material properties at nanometer thicknesses by implementing a specific sputtering gas composition parameter (at least 50 volume% krypton). This parameter change creates a reproducible deposition mechanism that yields consistent electrical and mechanical properties regardless of film thickness. The krypton-based process parameters are optimized to ensure uniform atomic distribution and controlled film density, making thin film properties predictable and controllable.
Solution Approach 2:
The patent employs feedback mechanisms by carefully controlling and monitoring the sputtering process parameters, including gas composition, pressure, and power input. The process is designed with feedback loops that adjust deposition conditions in real-time to maintain consistent film properties across different thicknesses. This feedback control ensures that even at thicknesses below 100 nanometers, the material properties remain within specified tolerances and are highly reproducible.
3Quantity of substance
If the thickness of the conductive layer is reduced, then the amount of precious metal is decreased, but the adhesion and abrasion resistance deteriorate
Solution Approach 1:
The patent utilizes parameter changes in the sputtering process, specifically employing a krypton-based gas composition, to fundamentally alter the film formation mechanism. This creates a denser, more cohesive film structure with enhanced interfacial bonding to the substrate. The modified deposition parameters produce a conductive layer with superior mechanical adhesion and abrasion resistance despite the reduced thickness, eliminating the typical trade-off between film thinness and mechanical strength.
4Quantity of substance
If the thickness of the conductive layer is reduced, then the amount of precious metal is decreased, but the corrosion resistance deteriorates
Solution Approach 1:
The patent applies parameter changes by using a krypton-based sputtering atmosphere to fundamentally alter the film microstructure and density. This creates a more uniform, defect-free conductive layer with reduced porosity and improved barrier properties against corrosive environments. The modified deposition process parameters enhance the inherent corrosion resistance of the thin film, allowing it to maintain protective functionality despite the reduced material quantity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution maintains equivalent performance to thicker layers while significantly reducing precious metal usage, achieving low resistivity, high adhesion, and enhanced corrosion and abrasion resistance at very thin thicknesses, as demonstrated by improved electrochemical performance and cyclic voltammetry results.
Implementation Method 1
a conductive layer which is sputtered onto a substrate
Data Source
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AI summary
Embodiments of the present disclosure are directed to thin conductive composites, such as biosensor electrodes, containing a polymeric film substrate a conductive layer disposed adjacent the substrate. The conductive layer includes Krypton and a conductive material. The conductive layer has an average thickness of no greater than about 150 nanometers. The conductive layer has a normalized thickness (t/?) of no greater than about 3.0. Further, the composite has a sheet resistance of no greater than about 97.077t-1.071 ohm/sq, where t represents the thickness of the conductive layer in nanometers.