CMOS Biosensor with Self-Assembled Monolayer on Metallic Carrier
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Solution Overview
Problem
Conventional sensor devices, such as biosensors, are difficult and expensive to integrate into chips due to complex and costly production procedures, making them challenging to manufacture at low costs in high volume production.
Innovation Solution
A sensor device with a self-assembled monolayer (SAM) positioned directly on a metallic carrier, which simplifies the manufacturing process and allows for easy integration into IC circuits, utilizing CMOS technology to create a sensitive and cost-effective sensor chip.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional sensor devices are integrated into chips using traditional production procedures, then sensing functionality is achieved, but manufacturing cost increases and manufacturing complexity increases
Solution Approach 1:
The patent merges the sensor active region directly into the semiconductor substrate using standard CMOS fabrication processes, eliminating the need for separate sensor components and complex integration procedures. The metallic carrier, SAM formation layer, and sensing elements are all integrated within the same chip structure, reducing both manufacturing cost and complexity while maintaining sensing functionality.
Solution Approach 2:
The semiconductor substrate serves multiple functions: it acts as the base substrate, the metallic carrier formation layer, and the sensing element substrate. The interdigitated electrode structures serve both as electrical connections and as the active sensing elements. This multi-functionality reduces the number of manufacturing steps and lowers production costs.
2Reliability
If conventional sensor devices are integrated into chips using traditional production procedures, then sensing functionality is achieved, but device complexity increases
Solution Approach 1:
The patent combines multiple sensor components into a single integrated structure on the semiconductor substrate. The metallic carrier, SAM formation layer, and interdigitated electrodes are all fabricated using the same CMOS process steps, eliminating the need for separate assembly procedures and reducing device complexity.
Solution Approach 2:
The self-assembled monolayer (SAM) formation process utilizes spontaneous molecular assembly to create the sensing interface, eliminating the need for complex deposition or patterning steps. The SAM molecules automatically organize themselves on the metallic carrier surface, simplifying the manufacturing process while ensuring consistent sensor performance.
3Ease of manufacture
If sensor active region comprises metallic carrier with self-assembled monolayer positioned directly on it, then manufacturing cost decreases and ease of manufacture improves, but sensitivity may be compromised
Solution Approach 1:
The patent optimizes the parameters of the SAM formation layer, including thickness, composition, and molecular structure, to maximize sensing sensitivity. By carefully controlling these parameters during the self-assembly process, the patent achieves both low manufacturing cost and high measurement precision simultaneously.
Solution Approach 2:
The patent replaces complex mechanical or chemical deposition methods with the self-assembly mechanism of molecular layers. This substitution maintains sensitivity by ensuring uniform and precise coverage of the metallic carrier surface, while significantly simplifying the manufacturing process and reducing costs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The sensor device achieves proper sensitivity and ease of manufacturing at low costs, enabling high volume production and integration with other on-chip elements, such as electronics, while maintaining high signal-to-noise ratio and spatial resolution.
Implementation Method 1
a self assembled monolayer (SAM) positioned directly (particularly without any material between the SAM and the metallic carrier) on the metallic carrier
Implementation Method 2
capture particles immobilized on a surface of a biosensor, may selectively attach with target particles in, for instance, a fluidic sample. When such attachment or sensor events occur at the sensor surface, this may change the electrical properties of the surface
Data Source
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AI summary
A sensor device (100) for sensing particles is configured as a biosensor and comprises a substrate (102) that is a semiconductor substrate, and a sensor active region (108) arranged in and/or on the substrate (102) and being sensitive to the presence of the particles to be detected. The sensor active region (108) comprises a metallic carrier (103, 105, 304, 440), and a self assembled monolayer (106) positioned on the metallic carrier (103, 105, 304, 440). The metallic carrier comprises one of the group consisting of a meander-shaped line (304), a zig-zag-shaped line, a spiral line (440), and interdigitated electrodes (103, 105).