Complementary Biosensor Wafer Recesses for Parallel Functionalization

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Solution Overview

Problem

Existing methods for wafer-level surface functionalization in chip-integrated biosensors are inefficient, requiring protective coatings and limiting parallelization, and are not suitable for all chemical compounds, especially sensitive or large precursor molecules.

Innovation Solution

A biosensor wafer arrangement comprising a sensor wafer with integrated biosensor recesses and a microfluidic wafer with complementary microfluidic channel-section recesses, allowing for fluidic interconnections and independent cleaning or functionalization of biosensor surfaces, with optional chemical compounds like amines, epoxides, thiols, or polyethylene glycol.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If inkjet process is used for wafer-level surface functionalization, then localization control of surface treatment is improved, but processing speed and productivity deteriorate

Engineering Contradiction:

Improvelocalization control of surface treatmentVSAvoidprocessing speed

Core Design Contradiction:

Manufacturing precisionVSProductivity

Solution Approach 1:

The wafer surface is segmented into multiple recess structures (first recesses and second recesses) that can be independently treated. The inkjet process applies functionalization material to specific recesses while leaving others untouched, enabling selective functionalization at wafer level without requiring sequential processing of each sensor element, thus improving productivity while maintaining localization control.

Inventive Principle:

Principle #1Segmentation

2Productivity

If MLD technique is used for surface functionalization, then parallelization is improved, but device complexity and process steps increase

Engineering Contradiction:

Improveparallelization capabilityVSAvoidprocess steps

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The recess structures are pre-formed on the wafer surface before functionalization. This preliminary structuring allows subsequent MLD or inkjet processes to directly treat only the recess areas without requiring additional protective coating steps, reducing overall process complexity while maintaining parallelization capability.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The functionalization process is extracted and concentrated to only the recess areas of the wafer surface. By confining the surface treatment to these pre-defined regions, the process avoids the need for complex photomask alignment and protective coating steps, simplifying the overall workflow while enabling parallel processing of multiple sensor elements.

Inventive Principle:

Principle #2Taking out (Extraction)

3Manufacturing precision

If protective coating is applied before MLD, then selective functionalization is improved, but processing time and complexity increase

Engineering Contradiction:

Improveselective functionalizationVSAvoidprocessing time

Core Design Contradiction:

Manufacturing precisionVSLoss of time

Solution Approach 1:

The recess structures are created in advance before the functionalization step. This preliminary structuring inherently provides the selectivity needed for functionalization without requiring additional protective coatings, thereby eliminating the time-consuming steps of coating application, patterning, and removal while maintaining precise selective functionalization.

Inventive Principle:

Principle #10Preliminary action

4Manufacturing precision

If inkjet process is used, then selective surface treatment is improved, but cleaning capability deteriorates

Engineering Contradiction:

Improveselective surface treatmentVSAvoidsurface cleaning capability

Core Design Contradiction:

Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The wafer surface is segmented into recess structures that physically isolate different areas. This segmentation allows cleaning processes to access and treat the recess surfaces independently of the surrounding planar areas, enabling effective removal of impurities and reagent residues from functionalized regions without affecting non-functionalized areas, thus restoring cleaning capability while maintaining selective treatment precision.

Inventive Principle:

Principle #1Segmentation

Data Source

PatentEP4579216A1Biosensor comprising a sensor wafer with backside etched recesses complementary to the front side etched recesses of a microfluidic wafer

Publication Date: 2025.07.02 IHP GMBH INNOVATIONS FOR HIGH PERFORMANCE MICROELECTRONICS LEIBNIZ INSTITUT FÜR INNOVATIVE MIKROELEKTRONIK

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Figure 7A~10

AI summary

A biosensor wafer arrangement comprises a sensor wafer and a microfluidic wafer. The sensor wafer comprises integrated components. On its opposite back side, it has integrated biosensor recesses. The biosensor recesses are fluidically isolated from each other and have a biosensor surface connected with components on the front side for sensor signal communication through the sensor wafer. The biosensor recesses are provided in a first pattern. The microfluidic wafer, on its front side, comprises microfluidic channel-section recesses that are fluidically isolated from each other, and are provided in a second pattern complementary to the first pattern. The sensor wafer and the microfluidic wafer may be combined back-to-front and fluid-tight, and positioned relative to each other such that microfluidic-channel sections on the microfluidic wafer overlap with pairs of biosensor recesses on the sensor wafer to establish a microfluidic interconnection between the pairs of biosensor recesses via the microfluidic-channel sections.