Biosensor Wells via MacEtch Gold Discs
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Solution Overview
Problem
Existing biochips face limitations in minimizing critical dimension and increasing aspect ratio of reaction wells due to processing constraints of photolithography, affecting sensitivity and throughput in biomolecule identification and analysis.
Innovation Solution
A biosensor structure formed using a metal-assisted chemical etching (MacEtch) process with gold discs at the bottom of wells, defined by the position of gold discs, allowing for reduced critical dimension and increased aspect ratio of wells, enhancing sensitivity and throughput, and utilizing self-assembly Au—S bonding for biosample capture without additional immobilization steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If photolithography process is used to fabricate reaction wells, then manufacturing process is simple and well-established, but critical dimension cannot be minimized and aspect ratio cannot be increased
Solution Approach 1:
The patent changes the fabrication process parameters by transitioning from photolithography to metal-assisted chemical etching (MacEtch). This process parameter change enables precise control of well dimensions and aspect ratio while maintaining manufacturing feasibility through a different mechanism that uses gold discs as etching catalysts and position definitions.
Solution Approach 2:
The patent replaces the photolithography mechanical/optical system with a chemical etching system. Instead of using light exposure and photoresist patterns, the invention uses chemical reactions initiated by gold discs to define well positions and dimensions, substituting one fabrication paradigm with another that overcomes the specific limitations of photolithography.
2Reliability
If photolithography is used for reaction well fabrication, then process is well-established, but sensitivity and throughput are limited
Solution Approach 1:
By changing the fabrication process to MacEtch, the patent achieves superior control over well dimensional parameters (critical dimension and aspect ratio). These parameter improvements directly enhance sensitivity and throughput in biomolecule identification, as the optimized well geometry improves reaction efficiency and detection capability.
3Productivity
If additional immobilization steps are used for biosample capture, then capture efficiency is ensured, but process complexity and time increase
Solution Approach 1:
The gold discs perform dual functions: they serve as position definitions for well fabrication and simultaneously function as biosample capture surfaces through self-assembly Au-S bonding. This self-service capability eliminates the need for separate immobilization steps, as the gold discs automatically capture biosamples containing sulfur groups without additional processing.
Solution Approach 2:
The gold discs are designed to perform multiple functions within the biosensor system. They act as (1) etching catalysts during fabrication, (2) position markers for well definition, and (3) biosample capture surfaces through chemical bonding. This multi-functionality reduces overall system complexity while maintaining or enhancing performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The biosensor structure achieves improved sensitivity and throughput by reducing critical dimension and increasing aspect ratio of wells, and effectively captures biosamples through self-assembly Au—S bonding, eliminating the need for further modifications at the gold disc location.
Implementation Method 1
utilizing self-assembly Au—S bonding for biosample capture without additional immobilization steps
Data Source
AI summary
A biosensor structure is provided. The biosensor structure includes a substrate, an insulating layer, a semiconductor layer and a gold disc. The insulating layer is disposed on the substrate. The semiconductor layer is disposed on the insulating layer, and a well is disposed in the semiconductor layer. The gold disc is disposed at bottom of the well.