Biosurfactant CMP Slurry for Selective and Greener Polishing

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Solution Overview

Problem

Existing chemical mechanical polishing (CMP) slurries in the semiconductor industry rely on petroleum-based surfactants and energy-intensive processes, which have a significant environmental footprint and may not provide optimal polishing selectivity between substrate constituents.

Innovation Solution

A polishing composition comprising at least one abrasive, a pH adjuster, and a biosurfactant, such as glycolipids or lipopeptides, which are biodegradable and produced by microorganisms, offering improved polishing selectivity and reduced environmental impact.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If petroleum-based surfactants are used in CMP slurries, then polishing process effectiveness is maintained, but environmental footprint increases

Engineering Contradiction:
Improveenvironmental footprintVSAvoidpolishing process effectiveness
Core Design Contradiction:
Object-affected harmful factorsVSReliability

Solution Approach 1:

The patent substitutes petroleum-based surfactants with biosurfactants (rhamnolipids, sophorolipids, or glycolipids) produced through biological fermentation processes. This parameter change in the chemical composition maintains the surfactant functionality for polishing process effectiveness while dramatically reducing the environmental footprint through biodegradability and renewable sourcing.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent replaces chemically synthesized petroleum-based surfactants with biologically produced surfactants. This substitution uses biological systems (microbial fermentation) to produce the necessary chemical compounds, replacing traditional petroleum refining and chemical synthesis processes with a more environmentally friendly biological production method.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Object-affected harmful factors

If conventional surfactants are used, then polishing selectivity is achieved, but environmental sustainability deteriorates

Engineering Contradiction:
Improveenvironmental sustainabilityVSAvoidpolishing selectivity
Core Design Contradiction:
Object-affected harmful factorsVSManufacturing precision

Solution Approach 1:

The patent changes the chemical parameters by using biosurfactants with specific molecular structures (rhamnolipids, sophorolipids, glycolipids) that provide the necessary surface activity for polishing selectivity. These biologically produced surfactants maintain the functional properties needed for selective material removal while improving environmental sustainability through biodegradability and renewable feedstock.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent employs composite polishing slurry formulations that integrate biosurfactants with abrasive particles and other slurry components. This composite approach ensures that the environmentally friendly biosurfactant works synergistically with other slurry ingredients to maintain polishing selectivity and overall process performance.

Inventive Principle:
Principle #40Composite materials

3Use of energy by moving object

If energy-intensive chemical processes are used for surfactant production, then surfactant performance is achieved, but energy consumption increases

Engineering Contradiction:
Improveenergy consumptionVSAvoidsurfactant performance
Core Design Contradiction:
Use of energy by moving objectVSReliability

Solution Approach 1:

The patent replaces energy-intensive petroleum-based chemical synthesis processes with biological fermentation processes for surfactant production. Microorganisms convert renewable feedstocks into biosurfactants through controlled fermentation, which typically consumes less energy than conventional petrochemical refining and chemical synthesis, while maintaining surfactant performance.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the production methodology parameter from chemical synthesis to biological fermentation. This parameter change in the production process reduces energy consumption by utilizing milder biological conditions (lower temperatures and pressures) compared to the high-energy chemical processes required for petroleum-based surfactant synthesis.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The use of biosurfactants enhances the polishing process, providing improved polishing efficacy, combined with a significantly reduced environmental footprint, while still being capable of providing the effectiveness of the polishing selectivity between substrate constituents by enhancing the effectiveness of the polishing selectivity between substrate constituents by enhancing the effectiveness of the polishing selectivity of the polishing selectivity of the polishing selectivity of the polishing process, providing the effectiveness of the polishing process, which are biodegradable and energy intensive processes, which have a favorable environmental and energy profile (e.g., biodegradability and/or production by less energy intensive processes).

Implementation Method 1

a biosurfactant selected from the group consisting of glycolipids, lipopeptides, and mixtures thereof

Methodology Applied
Scientific EffectSurfactant: Surfactant

Implementation Method 2

the use of biosurfactants enhances the polishing process, providing improved polishing efficacy

Methodology Applied
Scientific EffectWetting: Wetting

Implementation Method 3

CMP is a process used to planarize/flatten a wafer surface by removing material using abrasion-based physical processes

Methodology Applied
Scientific EffectAbrasion: Abrasion

Implementation Method 4

removing material using abrasion-based physical processes concurrently with surface-based chemical reactions

Methodology Applied
Scientific EffectChemical reactions: Chemical Bonding

Data Source

PatentEP4204505B1Polishing compositions and methods of using the same
Publication Date: 2025.11.05 FUJIFILM ELECTRONIC MATERIALS U S A INC
  • EP4204505B1 patent drawing
  • EP4204505B1 patent drawing
  • EP4204505B1 patent drawing

AI summary

This disclosure relates to a polishing composition that includes at least one abrasive; at least one pH adjuster, and at least one biosurfactant, as well as a method of using the polishing composition to polish a substrate. The biosurfactant can be selected from the group consisting of glycolipids, lipopeptides, and mixtures thereof.