Building Integrable Photovoltaic Connector with High RTI Insulation

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Solution Overview

Problem

Existing photovoltaic modules for building integration face challenges in withstanding high operating temperatures and require separate mounting hardware, leading to increased costs and complexity in installation.

Innovation Solution

Development of building-integrable photovoltaic (BIP) modules with electrically interconnected photovoltaic cells and conductive elements, using temperature-resistant materials with a Relative Temperature Index (RTI) of at least 115°C for insulation and mechanical integration, along with innovative connector designs for easy installation and interconnection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional photovoltaic modules are used for building integration, then electrical connections can be established, but the modules cannot withstand high operating temperatures and require separate mounting hardware

Engineering Contradiction:

Improvetemperature resistanceVSAvoidmounting hardware requirements

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines the mounting function and electrical connection function into a single integrated connector assembly. The connector includes mounting features (flanges, fastening elements) and conductive elements (sockets, pins) that simultaneously perform mechanical attachment and electrical interconnection, eliminating the need for separate mounting hardware and improving temperature resistance through unified material selection with RTI≥115°C

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent employs composite material construction for the connector body, combining materials with high temperature resistance (RTI≥115°C) with appropriate mechanical and electrical properties. This includes using temperature-resistant polymers or composites that maintain structural integrity and electrical insulation at elevated operating temperatures while providing adequate mechanical strength for building integration

Inventive Principle:

Principle #40Composite materials

2Ease of operation

If separate mounting hardware is used for BIP modules, then mechanical installation can be achieved, but installation costs and complexity increase

Engineering Contradiction:

Improveinstallation simplicityVSAvoidnumber of components

Core Design Contradiction:

Ease of operationVSDevice complexity

Solution Approach 1:

The connector integrates mounting features (flanges, fastening elements) directly with the electrical connection components, creating a single unified assembly that performs both mechanical attachment and electrical interconnection functions simultaneously, thereby simplifying installation procedures and reducing the total number of parts that need to be handled during installation

Inventive Principle:

Principle #5Merging (Combining)

3Temperature

If temperature resistant materials with RTI≥115°C are used for insulation, then electrical components can withstand high temperatures, but material selection and manufacturing complexity increase

Engineering Contradiction:

Improveoperating temperature resistanceVSAvoidmaterial selection complexity

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

The patent specifies a minimum temperature resistance parameter (RTI≥115°C) for the connector materials, allowing manufacturers to select from multiple materials that meet this threshold. This parameter-based approach simplifies material selection by establishing a clear performance criterion rather than requiring evaluation of numerous material properties, while ensuring adequate temperature resistance for building integration applications

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

BIP modules effectively withstand higher temperatures, reduce installation costs by integrating with building structures like rooftops without separate mounting hardware, and provide efficient electrical connections, enhancing labor and material savings while maintaining performance over time.

Implementation Method 1

These and other electrical components are electrically insulated using a temperature resistant material having a Relative Temperature Index (RTI) of at least about 115° C.

Methodology Applied

Scientific EffectElectrical insulation: Dielectric

Implementation Method 2

Multiple modules may be arranged into photovoltaic arrays used to convert solar energy into electricity by the photovoltaic effect

Methodology Applied

Scientific EffectPhotovoltaic effect: Photovoltaic Effect

Data Source

PatentUS9935225B2Electrical connectors of building integrable photovoltaic modules

Publication Date: 2018.04.03 BEIJING APOLLO DING RONG SOLAR TECH

AI summary

Provided are novel building integrable photovoltaic (BIP) modules and methods of fabricating thereof. A module may be fabricated from an insert having one or more photovoltaic cells by electrically interconnecting and mechanically integrating one or more connectors with the insert. Each connector may have one or more conductive elements, such as metal sockets and/or pins. At least two of all conductive elements are electrically connected to the photovoltaic cells using, for example, bus bars. These and other electrical components are electrically insulated using a temperature resistant material having a Relative Temperature Index (RTI) of at least about 115° C. The insulation may be provided before or during module fabrication by, for example, providing a prefabricated insulating housing and/or injection molding the temperature resistant material. The temperature resistant material and/or other materials may be used for mechanical integration of the one or more connectors with the insert.