Bipartite Housing Power Submodule for Thermal Management
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Solution Overview
Problem
Existing power electronic submodules face challenges in simple construction and integration into power semiconductor modules or systems, particularly in ensuring reliable electrical connections and thermal management.
Innovation Solution
A power electronic submodule design featuring a substrate with insulated conductor tracks, a power semiconductor component, a film composite connection device, and an insulating material body with a pressure element to ensure secure and thermally stable connections, using high-temperature-resistant materials like polyphenylene sulphide and silicone rubber for the insulating body and pressure elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a traditional single-piece housing is used, then the structural integrity is maintained, but the assembly complexity and manufacturing difficulty increase
Solution Approach 1:
The housing is divided into a first partial body and a second partial body that can be assembled separately. The first partial body forms the base structure with conductor tracks, while the second partial body is assembled onto it, simplifying manufacturing and assembly processes while maintaining structural integrity.
2Reliability
If pressure elements are added to ensure reliable connections, then connection reliability improves, but the device complexity increases
Solution Approach 1:
The pressure element is integrated into the second partial body of the housing, combining the structural support function with the connection pressure function. This eliminates the need for separate pressure element components while ensuring reliable electrical connections through the conductor tracks.
Solution Approach 2:
The second partial body acts as an intermediary component that provides both structural support and applies pressure through its integrated pressure element to ensure reliable connections between the conductor tracks and electrical contacts.
3Temperature
If high-temperature-resistant materials are used, then thermal stability improves, but manufacturing cost increases
Solution Approach 1:
High-temperature-resistant materials are used specifically in the first partial body where thermal management is critical for the conductor tracks and electrical connections. This localized application of expensive materials provides thermal stability where needed while controlling overall manufacturing costs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates a simple and robust construction of power semiconductor modules or systems with improved thermal management and reliable electrical connections, enabling efficient operation across varying temperatures.
Implementation Method 1
a pressure element projects, wherein the second partial body is movable relative to the first partial body in the direction of the substrate in order to press with the pressure element onto a section of the second main surface of the film composite
Implementation Method 2
an insulating material body (5) having a first partial body (52, 54), which is connected to an edge (26) of the substrate (2)
Implementation Method 3
the first partial body is connected to the edge of the substrate partly or completely, preferably cohesively, more preferably by an adhesive connection
Data Source
AI summary
A submodule comprising: a substrate, a power semiconductor component, a connection device, a terminal device and an insulating body. The substrate has conductor tracks electrically insulated from one another, and the component is electrically conductively connected to a track. The connection device is a film composite with a first surface facing the component and the substrate and an opposed second surface. The insulating body has: a first partial body, connected to an edge of the substrate, a first cutout for a terminal, a second partial body, embodied as a pressure body and a second cutout, with a pressure element projecting therefrom. The second partial body is movable relative to the first partial body in the direction of the substrate to press with the pressure element onto a section of the second surface. The section is within the area of the component in projection along the direction of the normal thereto.