Biphasic Conductive Layer via Liquid Metal Alloying
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Solution Overview
Problem
Existing methods for manufacturing stretchable electrical conductors face limitations in achieving high electrical conductivity and low production costs, with solid conductive films having low conductivity and complex, costly multistep processes, while liquid metal methods struggle with thin film formation and microchannel constraints.
Innovation Solution
A method involving the combination of solid and liquid metals, where a solid metal layer is deposited on a substrate, alloyed with liquid metal to form a biphasic conductive layer with percolating liquid paths, enhancing conductivity and stretchability, and allowing the liquid metal to accumulate for improved film properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If solid conductive films are used to form stretchable interconnections, then the manufacturing process becomes complex and costly with multiple steps, but the electrical conductivity remains low (100 to 1000 S/cm for composite films, 10^6 S/cm for microcracked Au)
Solution Approach 1:
The patent changes the physical state parameter of the conductive material from solid to liquid, enabling a simpler single-step deposition process while achieving high conductivity. Liquid metal is deposited directly onto the elastomeric substrate without requiring complex multistep solid film formation processes, thereby improving ease of manufacture while maintaining electrical reliability.
Solution Approach 2:
The patent creates a composite structure by embedding liquid metal within an elastomeric matrix. This composite approach allows the liquid metal to provide high conductivity pathways while the elastomer provides mechanical stretchability, resolving the contradiction between manufacturing simplicity and electrical performance.
2Reliability
If liquid metal is used to form conductive films, then thin film formation and microchannel constraints become problematic, but high conductivity and stretchability are achieved
Solution Approach 1:
The patent uses an elastomeric substrate as a flexible matrix that can accommodate liquid metal deposition. The elastomer's flexibility allows for thin film formation without rigid microchannel constraints, enabling the liquid metal to form conductive pathways that conform to the substrate's mechanical properties while maintaining manufacturing precision.
Solution Approach 2:
The elastomeric substrate acts as an intermediary between the liquid metal and the final device structure. It provides a compliant matrix that controls liquid metal distribution and enables thin film formation without requiring precise microchannel fabrication, thereby improving manufacturing precision while maintaining the high conductivity benefits of liquid metal.
3Reliability
If solid conductive films are used, then manufacturing costs increase due to complex multistep processes, but electrical performance can be maintained
Solution Approach 1:
The patent changes the deposition method from complex multistep solid film processes to a simpler liquid metal deposition process. This parameter change reduces manufacturing steps and associated costs while maintaining electrical functionality, as the liquid metal inherently provides high conductivity pathways upon deposition onto the elastomeric substrate.
4Reliability
If stretchable interconnections are designed to withstand mechanical deformations, then electrical properties must be maintained during deformation, but conventional solid films show degradation after repeated torsions and extensions
Solution Approach 1:
The patent uses liquid metal, which flows like a fluid, to create conductive pathways that can dynamically redistribute during mechanical deformation. This fluid-like behavior allows the conductive network to maintain electrical connectivity during repeated torsions and extensions, preventing the degradation seen in rigid solid films while maintaining electrical property stability.
Solution Approach 2:
The patent introduces dynamic adaptability by using liquid metal that can flow and redistribute in response to mechanical stress. This dynamic property allows the conductive pathways to self-adjust during deformation, maintaining electrical connectivity over repeated cycles where static solid films would fail, thereby improving durability under repeated deformation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the formation of thin, high-conductivity, stretchable interconnections with reduced manufacturing complexity and cost, maintaining electrical performance even under significant mechanical strain.
Implementation Method 1
allowing said liquid metal and said solid layer to alloy by diffusion of said liquid metal into said solid layer or film
Implementation Method 2
said liquid metal may be deposited on said solid conductive metal layer or film by thermal vapour deposition of said liquid metal
Data Source
AI summary
A method for manufacturing an electrical conductor includes: depositing a solid metal conductive layer or film on a substrate 30; depositing a liquid metal on the solid layer; and allowing the liquid metal and the solid layer 40 to alloy by diffusion of the liquid metal into the solid layer or film so as to form a solid conductive layer or film of the alloy; as well as allowing the liquid metal to further infiltrate the alloy so as to form percolating paths and/or droplets of the liquid metal in the the solid conductive layer or film, thus forming a biphasic conductive layer.