Integrated Biplane Optical Sensing Core Chip Vertical Stacking
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Solution Overview
Problem
Conventional fiber-optic gyroscope miniaturization efforts fail to simultaneously reduce the length and width of the multifunctional integrated optical circuit (MIOC) while maintaining reciprocity, due to limitations in substrate material and waveguide design, leading to increased width and length of the MIOC.
Innovation Solution
An integrated biplane optical sensing core chip is developed, featuring a non-linear optical substrate with a first and second waveguide structure connected by a waveguide coupled fiber, where the waveguide structures are arranged to allow for vertical overlap and close proximity, eliminating the need for arc waveguides and maintaining reciprocity without increasing the overall size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If arc waveguides are used to connect the first Y-branch waveguide and the second Y-branch waveguide on the lithium niobate substrate to meet reciprocity requirements, then the reciprocity of light wave propagation is improved, but the curvature radius of the arc waveguide must be limited to a specific range (2 mm to 6 mm), which increases the width of the MIOC
Solution Approach 1:
The patent transitions from a two-dimensional planar arrangement of waveguides to a three-dimensional stacked configuration. The first and second Y-branch waveguides are arranged in different layers (stacked vertically) rather than being juxtaposed horizontally, allowing arc waveguides to connect them with smaller curvature radii, thereby reducing the overall width of the MIOC while maintaining reciprocity
Solution Approach 2:
The patent implements a nested or stacked layered structure where the first Y-branch waveguide and the second Y-branch waveguide are positioned in different layers. This vertical stacking allows the waveguides to be closely coupled in the vertical dimension while reducing their horizontal footprint, enabling compact MIOC design without compromising reciprocity
2Reliability
If the first Y-branch waveguide and the second Y-branch waveguide are juxtaposed on the lithium niobate substrate with openings facing the same direction to meet reciprocity, then the reciprocity requirement is satisfied, but the width of the MIOC increases due to the need to maintain distance between adjacent waveguide ends
Solution Approach 1:
The patent resolves the spatial conflict by moving the waveguides to different vertical layers. Instead of placing the first and second Y-branch waveguides side-by-side in the same plane (which requires maintaining horizontal distance), they are stacked vertically, allowing much closer proximity and reducing the MIOC width while preserving optical reciprocity
3Length of moving object
If the conventional beam splitter and Y-waveguide modulator are integrated on the lithium niobate substrate to shorten the fiber sensor length, then the length of the fiber sensor is reduced, but the width of the MIOC increases due to waveguide arrangement constraints
Solution Approach 1:
The patent employs vertical stacking of waveguide components in different layers to achieve compact integration. This three-dimensional arrangement allows the beam splitter and Y-waveguide modulator to be closely integrated, shortening the overall sensor length while the vertical layering minimizes the horizontal width of the MIOC
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integrated biplane optical sensing core chip achieves miniaturization while ensuring reciprocity and feasibility for economical mass production, suitable for applications in fiber-optic gyroscope or current sensors.
Implementation Method 1
a first waveguide structure having a first main waveguide and a first branch waveguide on the non-linear optical substrate, wherein the first branch waveguide is formed by a first branch optical waveguide and a second branch optical waveguide
Implementation Method 2
an integrated biplane optical sensing core chip which is formed by integrating an integrated optical coupler and an integrated electro-optic modulator on a non-linear optical substrate of a single material
Data Source
AI summary
An integrated biplane optical sensing core chip has a non-linear optical substrate, a first waveguide structure, a second waveguide structure and a waveguide coupled fiber. The non-linear optical substrate, the first waveguide structure and the second waveguide structure are made of the same nonlinear optical material. The first waveguide structure is connected to the second waveguide structure via a waveguide coupled fiber is outside and independent to the non-linear optical substrate. Therefore, the first waveguide structure and the second waveguide structure can overlap in the vertical direction, and can be set close to each other in the horizontal and vertical directions, so the integrated biplane optical sensing core chip can be miniaturized and can meet reciprocity. The integrated biplane optical sensing core chip is suitable for an optical fiber sensor, and the optical fiber sensor can be a fiber-optic gyroscope or a fiber-optic current sensor.