Bipod Flexure Ring Thermal Expansion Fingers
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Solution Overview
Problem
Coupling structures with high and low coefficients of thermal expansion, such as metallic and ceramic structures, face thermal mismatch issues that induce high strains in ceramics when rigidly joined, making it challenging to integrate them in elevated temperature applications.
Innovation Solution
A thermal coupling design featuring thermal expansion fingers and flanges in the high CTE structure, and a flange with fastener openings in the low CTE structure, allowing for relative expansion and retraction, and incorporating frame ribs and fastener rings to minimize thermal stresses through axial and radial expansion slots and fastener attachments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If rigid joining is used to couple high CTE and low CTE structures, then structural strength is improved, but thermal stress and strain in ceramic structure increase
Solution Approach 1:
The coupling structure is divided into multiple segments including a high CTE structure, a low CTE structure, and an intermediate structure with expansion fingers. This segmentation allows differential thermal expansion while maintaining overall structural integrity, resolving the contradiction between strength and thermal stress.
Solution Approach 2:
An intermediate structure serves as a mediator between the high CTE and low CTE structures. This intermediate structure with expansion fingers accommodates thermal expansion differences, reducing thermal stress transmission to the ceramic structure while maintaining coupling strength.
2Stability of the object's composition
If rigid joining is used to couple high CTE and low CTE structures, then structural stability is improved, but thermal expansion compatibility deteriorates
Solution Approach 1:
The coupling structure incorporates dynamic elements including expansion fingers and slots that allow movement during thermal cycling. This dynamic design enables the structure to adapt to thermal expansion differences while maintaining stability during operation.
Solution Approach 2:
The design changes the effective thermal expansion parameters by introducing an intermediate structure with specific geometric features (expansion fingers, slots) that modify the thermal response. This allows the coupled structure to accommodate different CTE values while maintaining overall stability.
3Object-affected harmful factors
If expansion fingers and slots are introduced to accommodate thermal expansion, then thermal stress is reduced, but device complexity increases
Solution Approach 1:
The expansion fingers act as flexible elements that can deform to accommodate thermal expansion. This flexible design reduces thermal stress while adding minimal complexity compared to rigid coupling alternatives.
Solution Approach 2:
The intermediate structure is segmented into expansion fingers connected by slots, creating a simple yet effective mechanism for thermal expansion accommodation. This segmented approach reduces complexity compared to more sophisticated expansion joints or compensators.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The thermal coupling effectively minimizes thermal stresses between high and low CTE structures during heating and cooling cycles, preventing damage to ceramic structures and enabling their integration in high-temperature applications by accommodating differential expansion.
Implementation Method 1
a first structure having a first coefficient of thermal expansion; a second structure having a second coefficient of thermal expansion lower than the first coefficient of thermal expansion
Data Source
AI summary
A thermal coupling includes a first structure having a first coefficient of thermal expansion; a second structure having a second coefficient of thermal expansion lower than the first coefficient of thermal expansion; a plurality of thermal expansion fingers provided in the first structure; a plurality of thermal expansion flanges extending from the plurality of thermal expansion fingers, respectively; and a flange extending from the second structure and attached to the plurality of thermal expansion flanges.