Bipolar Electrode Through-Hole Structure to Block Adhesive Contamination
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In bipolar lead-acid batteries, the adhesive used to bond lead layers to the base plate can contaminate the conductor in through holes, leading to reduced conduction area and increased electrical resistance, compromising bonding reliability and battery performance.
Innovation Solution
A bipolar electrode design featuring a conductor with a projecting portion around the bonding area prevents adhesive contamination by creating a barrier that redirects the adhesive away from the bonding zone, ensuring reliable bonding between the positive and negative electrode lead layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a liquid adhesive is applied to bond lead layers to the base plate, then bonding strength between the base plate and lead layers is improved, but the adhesive spreads along the base plate surface and contaminates the conductor in the through hole
Solution Approach 1:
The base plate surface is segmented into a bonding region and a non-bonding region by the protrusion structure. The protrusion divides the continuous surface into distinct zones, allowing adhesive to be confined to the bonding region while preventing spread to the conductor area.
Solution Approach 2:
The base plate is designed with different surface properties in different regions: the bonding region has adhesive-applicable surface characteristics, while the region around the through hole has a protrusion structure that prevents adhesive accumulation, creating locally optimized surface quality for each function.
Solution Approach 3:
The protrusion structure acts as an intermediary element between the bonding area and the through hole area. It serves as a physical barrier that mediates the adhesive flow, allowing bonding to occur while preventing contamination of the conductor.
2Strength
If more adhesive is applied to increase bonding area and bonding strength, then adhesion between base plate and lead foil is improved, but adhesive flow into the bonding portion of the conductor increases
Solution Approach 1:
The protrusion structure segments the base plate surface to create distinct adhesive application zones, enabling sufficient adhesive quantity to be applied for strong bonding while physically preventing excess adhesive from reaching the conductor bonding portion.
Solution Approach 2:
The protrusion serves as an intermediary barrier that allows the adhesive application process to proceed with sufficient quantity for strong bonding, while intercepting and containing the adhesive before it can contaminate the conductor bonding area.
3Strength
If the conductor surface is contaminated with adhesive, then bonding area and bonding strength are reduced, but electrical resistance between lead layers increases
Solution Approach 1:
The protrusion structure acts as a protective intermediary that prevents adhesive from reaching the conductor surface, thereby maintaining both bonding strength and electrical conduction reliability without compromise.
Solution Approach 2:
The protrusion structure provides self-protection for the conductor bonding area, automatically preventing adhesive contamination without requiring additional protective measures or processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the reliability of the bonding between the lead layers, preventing adhesive contamination and reducing electrical resistance, thereby achieving long-term reliability and high energy density in bipolar storage batteries.
Implementation Method 1
a positive electrode stuck to a first surface of the bipolar plate with an adhesion layer, and a negative electrode stuck to a second surface of the bipolar plate with an adhesion layer
Data Source
AI summary
A bipolar electrode for a bipolar lead-acid battery includes a base plate with a conduction through hole, a positive electrode stuck to a first surface of the base plate with an adhesion layer, and a negative electrode stuck to a second surface of the base plate with an adhesion layer. The bipolar electrode includes a conductor disposed in the through hole and has a bonding portion to which the positive electrode is electrically bonded on a first surface of the conductor and has a bonding portion to which the negative electrode is electrically bonded on a second surface of the conductor. The conductor has a projecting portion surrounding the periphery of the bonding portion on both the first surface and the second surface. By preventing contamination of the bonding portion with an adhesive, the bonding reliability between a positive electrode lead layer and a negative electrode lead layer is improved.