Bipolar Plasma Source for Uniform Large-Area PECVD Coatings

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Solution Overview

Problem

Current plasma enhanced chemical vapor deposition (PECVD) technologies face challenges in creating stable, uniform, and long plasmas for large area coatings, often resulting in bulky equipment, low coating efficiencies, and high energy consumption.

Innovation Solution

A plasma source with at least two electron emitting surfaces connected via an AC power source, applying a bipolar voltage to create a stable, uniform, and long plasma, which can be compact and efficient, using magnets for densification and maintaining surface cleanliness.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If conventional PECVD technologies are used to create plasma for large area coatings, then coating deposition can be achieved, but the equipment becomes bulky and device complexity increases

Engineering Contradiction:
Improvecoating areaVSAvoidequipment complexity
Core Design Contradiction:
Area of stationary objectVSDevice complexity

Solution Approach 1:

The plasma source is divided into multiple independent electron emitting surfaces (cathodes) arranged in an array, each capable of generating plasma independently. This segmentation allows the system to cover large substrate areas without requiring a single large complex plasma source, thereby reducing overall device complexity while maintaining large area coating capability

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The invention transitions from conventional single-plane plasma generation to a three-dimensional array configuration of electron emitting surfaces. By arranging cathodes in multiple rows and columns, the system achieves large area coverage through spatial distribution rather than increasing the complexity of a single plasma generation zone

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Productivity

If conventional PECVD methods are used, then thin film deposition is achieved, but coating efficiency and deposition rates remain low

Engineering Contradiction:
Improvedeposition rateVSAvoidenergy consumption
Core Design Contradiction:
ProductivityVSLoss of energy

Solution Approach 1:

The alternating current bipolar power supply continuously alternates the polarity between electron emitting surfaces, ensuring that plasma generation and material deposition occur continuously without interruption. This continuous operation eliminates idle time between deposition cycles, significantly increasing overall productivity and deposition rate while maintaining efficient energy utilization

Inventive Principle:
Principle #20Continuity of useful action

Solution Approach 2:

The invention changes the electrical parameters by applying high voltage alternating current to the electron emitting surfaces, creating a bipolar plasma environment. This parameter change enables higher deposition rates compared to conventional DC or single-frequency AC plasma sources, while the alternating nature optimizes energy consumption by preventing charge buildup and maintaining stable plasma conditions

Inventive Principle:
Principle #35Parameter changes

3Manufacturing precision

If plasma is generated for precursor gas activation, then thin film formation occurs, but stress and haze are introduced in the coatings

Engineering Contradiction:
Improvecoating qualityVSAvoidcoating stress and haze
Core Design Contradiction:
Manufacturing precisionVSObject-generated harmful factors

Solution Approach 1:

The alternating current power supply creates periodic reversal of electric field polarity between electron emitting surfaces. This periodic action allows for controlled plasma exposure cycles that promote uniform film growth while minimizing stress accumulation and haze formation, as the alternating fields prevent excessive ion bombardment in any single direction

Inventive Principle:
Principle #19Periodic action

Solution Approach 2:

The bipolar configuration with alternating polarity creates equipotential conditions between opposing electron emitting surfaces during each half-cycle. This equipotentiality ensures uniform plasma distribution and consistent precursor gas activation across the coating area, producing uniform thin films with minimal stress and haze defects

Inventive Principle:
Principle #12Equipotentiality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables high deposition rates, low stress, smooth, and haze-free large area coatings with reduced energy consumption, overcoming the limitations of existing PECVD systems.

Implementation Method 1

at least 2 electron emitting surfaces connected to each other via an AC power source, wherein the AC power source applies a bipolar voltage to the 2 electron emitting surfaces

Methodology Applied
Scientific EffectElectrical discharge: Electric Arc

Implementation Method 2

A plasma is composed of a partially ionized gas and free electrons, and each component has the ability to move somewhat independently

Methodology Applied
Scientific EffectPlasma: Plasma

Implementation Method 3

the present invention relates to a linear plasma source for plasma enhanced chemical vapor deposition (CVD)

Methodology Applied
Scientific EffectPlasma enhanced chemical vapor deposition: Plasma Enhanced Chemical Vapour Deposition

Implementation Method 4

using magnets for densification

Methodology Applied
Scientific EffectMagnetic field: Magnetic Field

Data Source

PatentUS10438778B2Plasma source and methods for depositing thin film coatings using plasma enhanced chemical vapor deposition
Publication Date: 2019.10.08 AGC INC
  • US10438778B2 patent drawing
  • US10438778B2 patent drawing
  • US10438778B2 patent drawing

AI summary

The present invention provides novel plasma sources useful in the thin film coating arts and methods of using the same. More specifically, the present invention provides novel linear and two dimensional plasma sources that produce linear and two dimensional plasmas, respectively, that are useful for plasma-enhanced chemical vapor deposition. The present invention also provides methods of making thin film coatings and methods of increasing the coating efficiencies of such methods.