Bipolar Transistor Isolation Structure with Composite Doping

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Solution Overview

Problem

Current semiconductor technologies face challenges in effectively forming bipolar junction transistors with optimal dopant conditions and isolation structures, leading to inefficiencies in charge carrier diffusion and device isolation.

Innovation Solution

A semiconductor structure comprising a bipolar transistor with distinct doped contacts and well regions, along with an isolation structure featuring a buried layer with different dopant conditions, is formed through a series of doping and diffusion processes to control dopant profiles and prevent punch-through issues.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a bipolar junction transistor is formed with conventional doping and isolation structures, then device isolation is achieved, but charge carrier diffusion efficiency is reduced and punch-through issues occur

Engineering Contradiction:
Improvedevice isolationVSAvoidcharge carrier diffusion efficiency
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The patent applies local quality by creating distinct dopant concentration zones within the isolation structure. The first dopant type (e.g., P-type) and second dopant type (e.g., N-type) are distributed in specific patterns within the isolation region, creating localized electrical properties that differ from uniform doping. This allows the isolation structure to provide both isolation and enhanced charge carrier diffusion pathways at specific locations, resolving the contradiction between isolation effectiveness and diffusion efficiency.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The isolation structure employs composite doping by combining two different dopant types within the same isolation region. This creates a composite semiconductor structure with varying carrier concentrations and types, enabling the structure to simultaneously provide electrical isolation for adjacent devices while creating favorable conditions for charge carrier diffusion through the dopant-modified regions, thus preventing punch-through without compromising diffusion efficiency.

Inventive Principle:
Principle #40Composite materials

2Reliability

If conventional isolation structures are used, then device isolation is provided, but punch-through prevention is insufficient

Engineering Contradiction:
Improveisolation effectivenessVSAvoidpunch-through effect
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent implements preliminary anti-action by pre-configuring the isolation structure with specific dopant distributions before device operation. The first and second dopants are introduced into the isolation structure in advance to create predetermined electrical barriers and potential wells that actively counteract the punch-through effect. This preemptive doping strategy establishes protective electrical conditions that prevent harmful charge carrier penetration between devices, addressing the punch-through issue before it can occur during device operation.

Inventive Principle:
Principle #9Preliminary anti-action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables efficient charge carrier diffusion and effective isolation, preventing punch-through and enhancing the performance of bipolar transistors by optimizing dopant conditions and isolation, thereby improving the overall semiconductor device operation.

Implementation Method 1

A semiconductor substrate is doped with a first dopant to form a first doped layer. The semiconductor substrate is doped with a second dopant heavier than the first dopant to form a second doped layer adjacent to the first doped layer.

Methodology Applied
Scientific EffectDoping: Dopants

Implementation Method 2

The first doped layer is diffused to form a first diffused layer. The second doped layer is diffused to form a second diffused layer surrounded by the first diffused layer.

Methodology Applied
Scientific EffectDiffusion: Diffusion

Data Source

PatentUS9590039B2Semiconductor structure and method for forming the same
Publication Date: 2017.03.07 UNITED MICROELECTRONICS CORP
  • US9590039B2 patent drawing
  • US9590039B2 patent drawing
  • US9590039B2 patent drawing

AI summary

A semiconductor structure and a method for forming same are provided. The semiconductor structure includes a bipolar transistor. The bipolar transistor includes a base doped contact, an emitter doped contact, a collector doped contact, and well regions. The base doped contact, the emitter doped contact and the collector doped contact are formed in the different well regions having different dopant conditions from each other.