BIS Sensor Remanufacturing Segmentation Strategy
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Bispectral index (BIS) sensors used for monitoring brain activity are typically disposable after a single use, leading to waste and increased costs, as they are designed for direct contact with patients and cannot be easily reused due to hygiene and functionality concerns.
Innovation Solution
The remanufacturing of BIS sensors involves refurbishing components such as electrodes, conductive gels, foam layers, and memory units, allowing for the reuse of certain parts while replacing others, such as conductive inks and adhesives, to create a functional, cost-effective, and environmentally friendly solution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If BIS sensors are designed for single-use disposable, then hygiene and functionality are ensured, but waste increases and costs rise
Solution Approach 1:
The sensor is divided into disposable patient-contact components (electrodes, conductive gel, foam layers) and reusable non-contact components (circuit board, connector, memory unit). This segmentation allows selective disposal of contaminated parts while retaining and refurbishing non-contaminated parts, resolving the contradiction between ensuring hygiene through single-use design and reducing waste.
Solution Approach 2:
The patent implements a remanufacturing process that recovers reusable components from used sensors through disassembly, cleaning, inspection, and refurbishment. Contaminated disposable components are discarded while non-contaminated components are recovered and reused, directly addressing the waste problem while maintaining hygiene standards through selective disposal.
2Reliability
If BIS sensors are designed for single-use disposable, then functionality is ensured, but manufacturing costs increase
Solution Approach 1:
The remanufacturing process recovers high-value reusable components (circuit board, connector, memory unit) from used sensors and refurbishes them for continued use. This recovery approach reduces the need to manufacture entirely new sensors, thereby lowering manufacturing costs while maintaining functionality through systematic refurbishment.
Solution Approach 2:
The patent changes the operational parameter of component lifespan from single-use to multi-use through a standardized refurbishment process. By systematically restoring components to functional condition and tracking their service history through memory units, the system enables cost-effective reuse while ensuring functionality is maintained.
3Loss of substance
If BIS sensors are made reusable through remanufacturing, then waste is reduced and costs lowered, but device complexity increases
Solution Approach 1:
By segmenting the sensor into disposable and reusable components with clear separation interfaces, the remanufacturing process becomes more manageable. The circuit board and connector are designed as distinct modules that can be easily separated from disposable components, simplifying the disassembly and refurbishment operations despite the added complexity of reuse.
Solution Approach 2:
The memory unit automatically tracks the service history and number of uses for each sensor and its components. This self-tracking mechanism simplifies quality control and refurbishment decision-making by providing automatic records of component condition and usage patterns, reducing the manual complexity of managing reusable devices.
4Ease of manufacture
If BIS sensors are refurbished and reused, then cost-effectiveness is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent incorporates preliminary protective measures during manufacturing, such as protective coatings on circuit boards and precise alignment features, that facilitate easier and more accurate refurbishment. These preliminary actions prepare components for future disassembly and reassembly, reducing the precision requirements during the refurbishment process while maintaining cost-effectiveness.
Data Source
AI summary
Remanufactured BIS sensors and methods for remanufacturing used BIS sensors are provided. Such a remanufactured sensor may include certain components from a used medical sensor and certain new components. For example, a remanufactured BIS sensor may include a backing layer and at least first, second, and third electrodes disposed on the backing layer having a conductive ink. The first, second, and third electrodes are adapted to be in electrical contact with a patient to perform BIS measurements. A foam layer may be disposed on at least a portion of the backing layer, and an adhesive may be attached to the foam layer and is configured to secure the remanufactured BIS sensor to the patient. The first electrode, the second electrode, the third electrode, the backing layer, or a combination thereof, may be new and the foam layer, the adhesive, or a combination thereof, may be from a used medical sensor.