Biscitraconimide Resin Composition for Low-Viscosity Dielectric Curing
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Solution Overview
Problem
Existing thermosetting resins used in electronic devices for high-frequency applications have high melt viscosities, leading to handling difficulties and result in hard, brittle cured products with inadequate dielectric characteristics and heat resistance.
Innovation Solution
A thermosetting biscitraconimide resin composition comprising biscitraconimide and monocitraconimide compounds, epoxy resin, an epoxy resin curing agent, and a curing accelerator, with specific components and ratios to achieve low viscosity and improved dielectric and thermal properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thermosetting resins (modified polyphenylene ether resin, maleimide resin) are used to achieve low dielectric constant and low dielectric loss tangent, then dielectric characteristics are improved, but melt viscosity becomes high and cured products become hard and brittle
Solution Approach 1:
The invention changes the chemical structure parameters of the resin by introducing citraconimide groups with specific molecular weight ranges (150-5000) and controlling the ratio of citraconimide groups to other functional groups (0.3-2.0), thereby achieving low viscosity while maintaining dielectric properties
Solution Approach 2:
The invention creates a composite resin system combining citraconimide resin with epoxy resin and curing agents, where the citraconimide component provides low viscosity and dielectric characteristics while the epoxy component contributes to mechanical strength and processability
2Reliability
If citraconimide resins are used to achieve lower melt viscosity and excellent dielectric characteristics, then dielectric properties and heat resistance are improved, but viscosity at room temperature becomes high compared to liquid epoxy resins
Solution Approach 1:
The invention controls the molecular weight of citraconimide resin (150-5000) and the ratio of citraconimide groups to functional groups (0.3-2.0) to optimize the balance between room temperature viscosity and dielectric properties, ensuring the resin remains processable while achieving target performance
Solution Approach 2:
The invention uses epoxy resin and curing agents as intermediary components that modify the physical properties of citraconimide resin, reducing its room temperature viscosity while preserving the low dielectric constant and loss tangent characteristics of the citraconimide structure
3Loss of energy
If thermosetting resins are used to achieve low dielectric constant, then transmission losses are decreased, but melt viscosity becomes high leading to processing difficulties
Solution Approach 1:
The invention optimizes the molecular weight and structural parameters of citraconimide resin to achieve low dielectric constant (2.0-3.0) while maintaining low viscosity for easy processing and filling of wiring boards
Solution Approach 2:
The invention formulates a composite system where citraconimide resin provides low dielectric constant for reduced transmission losses, while epoxy resin and curing agents ensure low viscosity and good processability during manufacturing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition provides a cured product with suitable viscosity for processing, low dielectric constant, low dielectric loss tangent, and excellent heat resistance, addressing handling and performance issues of existing resins.
Implementation Method 1
an epoxy resin curing agent
Implementation Method 2
a curing accelerator
Data Source
AI summary
Provided is a thermosetting biscitraconimide resin composition including (A) a biscitraconimide compound, (B) a monocitraconimide compound having a melting point of 60°C or less, (C) an epoxy resin, (D) an epoxy resin curing agent, and (E) a curing accelerator.