Biscitraconimide Resin Composition for Low-Viscosity High-Frequency Curing
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Solution Overview
Problem
Existing thermosetting resins used in electronic devices for high-frequency applications have high melt viscosities, leading to handling difficulties and result in hard, brittle cured products with inadequate dielectric characteristics and heat resistance.
Innovation Solution
A thermosetting biscitraconimide resin composition comprising biscitraconimide and monocitraconimide compounds, epoxy resin, an epoxy resin curing agent, and a curing accelerator, with specific molecular weights and ratios to achieve low viscosity and improved dielectric and thermal properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thermosetting resins (modified polyphenylene ether resin, maleimide resin) or thermoplastic resins (fluorocarbon resin, styrene resin, liquid crystal polymer) are used to achieve low dielectric constant and low dielectric loss tangent, then dielectric characteristics are improved, but melt viscosity becomes high and cured products become hard and brittle
Solution Approach 1:
The patent changes the chemical structure parameters of the resin by introducing citraconimide groups with specific molecular weight ranges (number-average molecular weight of 200 to 10,000) and controlling the ratio of citraconimide groups to epoxy groups (0.5 to 2.0 mol/mol), thereby achieving low viscosity while maintaining dielectric properties
Solution Approach 2:
The patent creates a composite resin system combining citraconimide compounds with epoxy resin and curing agents, forming a new material composition that integrates the low viscosity and excellent dielectric characteristics of citraconimide with the processing advantages and mechanical properties of epoxy-based systems
2Reliability
If citraconimide resins are used to achieve low melt viscosity and excellent dielectric characteristics, then dielectric properties and heat resistance are improved, but viscosity at room temperature becomes high compared to liquid epoxy resins
Solution Approach 1:
The patent optimizes the molecular weight parameters of the citraconimide compound (number-average molecular weight of 200 to 10,000) and controls the functional group ratio (citraconimide groups to epoxy groups: 0.5 to 2.0 mol/mol), thereby reducing room temperature viscosity while preserving the excellent dielectric and thermal properties of citraconimide resins
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition provides a cured product with suitable viscosity for processing, low dielectric constant, low dielectric loss tangent, and excellent heat resistance, addressing handling issues and enhancing performance in high-frequency electronic devices.
Implementation Method 1
an epoxy resin curing agent
Implementation Method 2
a curing accelerator
Data Source
AI summary
Provided is a thermosetting biscitraconimide resin composition including (A) a biscitraconimide compound, (B) a monocitraconimide compound having a melting point of 60° C. or less, (C) an epoxy resin, (D) an epoxy resin curing agent, and (E) a curing accelerator.