Oligoamide-Extended Bismaleimide Dielectrics for Low-CTE Packaging
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Solution Overview
Problem
Current dielectric materials for advanced electronic packaging, such as wafer-level packaging, lack a well-balanced profile of thermomechanical and dielectric properties, including high thermal stability, low coefficient of thermal expansion, high elongation at break, and good adhesive strength, which limits their application in next-generation microchip redistribution layers.
Innovation Solution
A new class of dielectric polymer material formed from oligoamide-extended bismaleimide compounds with specific structural units, offering improved thermomechanical and dielectric properties, high adhesive strength on copper and SiO2 passivated wafers, and excellent processability from common semiconductor industry solvents.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional dielectric materials are used for advanced electronic packaging, then manufacturing is simpler and cost is lower, but thermomechanical properties (thermal stability, CTE, elongation at break) are insufficient
Solution Approach 1:
The patent employs composite material design by combining oligoamide extenders with bismaleimide compounds to create a dielectric material that integrates multiple functional properties. The oligoamide component contributes to thermal stability and elongation at break, while the bismaleimide provides low CTE and dielectric performance, achieving a balanced profile that conventional single-material systems cannot provide.
Solution Approach 2:
The invention modifies material parameters by adjusting the oligoamide extender chain length and composition to optimize the balance between thermal expansion resistance and mechanical flexibility. By controlling the molecular structure parameters of the oligoamide-bismaleimide composite, the material achieves simultaneous improvement in Tg, elongation at break, and CTE matching requirements.
2Reliability
If dielectric materials with high thermal stability and low CTE are used, then reliability improves, but adhesive strength and processability deteriorate
Solution Approach 1:
The patent applies local quality by differentiating the functional roles within the composite material structure. The oligoamide extender segments provide local flexibility and adhesive functionality, while the bismaleimide units provide local thermal stability and low CTE. This spatial differentiation of properties within the molecular structure allows simultaneous achievement of thermal performance and adhesive strength.
Solution Approach 2:
The oligoamide extender acts as an intermediary component that bridges the rigid bismaleimide units, providing both mechanical flexibility and adhesive functionality. This intermediary structure enables the material to maintain strong adhesion to substrates and interfaces while preserving the thermal stability and low CTE characteristics of the bismaleimide backbone.
3Reliability
If materials with optimized thermomechanical properties are developed, then reliability improves, but manufacturing complexity and cost increase
Solution Approach 1:
The patent implements preliminary action by pre-synthesizing the oligoamide-extended bismaleimide compounds with controlled molecular weights and structures before final material fabrication. This preliminary structuring ensures that the materials possess the required thermomechanical properties from the outset, simplifying subsequent processing steps and reducing the need for complex post-processing adjustments.
Solution Approach 2:
The invention introduces dynamic adaptability in processing by optimizing the formulation to allow processing from commonly used solvents at controlled temperatures. The material exhibits appropriate viscosity and flow characteristics during application, then transitions to its final high-performance state upon curing, enabling ease of manufacture while maintaining superior thermomechanical properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The new dielectric polymer material enhances the reliability and cost-efficiency of microelectronic device manufacturing by reducing mechanical deformation and improving signal propagation, while maintaining high performance and reliability in advanced packaging applications.
Implementation Method 1
The dielectric polymer material of the present invention is formed by reacting a bismaleimide compound
Data Source
AI summary
The present invention relates to a new class of dielectric polymer material, which is particularly suitable for the manufacturing of electronic devices. The dielectric polymer material is formed by reacting bismaleimide compounds and shows an advantageous well-balanced profile of favorable material properties. The bismaleimide compounds have an oligomeric structure with an oligoamide extended repeating unit in the middle part of the molecule and maleimide groups at each terminal end of the molecule. There is further provided a method for forming said dielectric polymer material. Beyond that, the present invention relates to the dielectric polymer material and to an electronic device comprising the same.