Bismaleimide Resin Composition for High-Density Wiring
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Solution Overview
Problem
Conventional resin compositions for multilayer printed wiring boards face issues with insufficient heat resistance, thermal stability, and insulation reliability, particularly when using (meth)acrylate-based resins, bismaleimide compounds, and photocurable binders, which limit their application in forming high-density and detailed wiring patterns.
Innovation Solution
A resin composition comprising a bismaleimide compound with maleimide groups at both ends of the molecular chain, combined with a cyanate compound, benzoxazine compound, epoxy resin, or carbodiimide compound, and a photo initiator, optimized for photocurability, heat resistance, and thermal stability, allowing efficient curing under various active energy rays.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If (meth)acrylate-based resins are used for rapid curing in the exposure step, then photocurability is improved, but heat resistance and thermal stability deteriorate
Solution Approach 1:
The patent uses a composite resin composition containing both (meth)acrylate groups for rapid photocuring and bisphenol-based epoxy resin for heat resistance. The combination allows the material to achieve both fast curing speed and high thermal stability, resolving the contradiction between photocurability and heat resistance.
2Ease of manufacture
If conventional resin compositions are used, then ease of manufacture is maintained, but insulation reliability deteriorates
Solution Approach 1:
The patent modifies the chemical composition parameters of the resin by incorporating specific ratios of (meth)acrylate-modified epoxy resin, bisphenol-based epoxy resin, and cyanate resin. This parameter optimization achieves both high insulation reliability and maintains ease of manufacture through standard lamination processes.
3Length of stationary object
If resin sheets without glass cloth are used for thinning, then laminate thickness is reduced, but mechanical strength deteriorates
Solution Approach 1:
The patent employs a composite resin system combining epoxy resins with cyanate resin to achieve high mechanical strength without glass cloth reinforcement. The synergistic interaction between these resins provides sufficient structural integrity for thin laminates, enabling reduced thickness while maintaining strength.
4Productivity
If high density wiring patterns are formed, then productivity is improved, but manufacturing precision deteriorates
Solution Approach 1:
The patent optimizes the resin composition parameters, particularly the viscosity and curing characteristics, to enable precise formation of high-density wiring patterns. The balanced formulation allows for better pattern definition and alignment accuracy while maintaining high wiring density.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition achieves excellent photocurability, heat resistance, and thermal stability, enabling the formation of high-density and detailed wiring patterns on multilayer printed wiring boards and semiconductor devices with improved insulation reliability.
Implementation Method 1
a resin composition in which an exposed portion is cured by irradiation of rays of light or the like (exposure step)
Data Source
AI summary
A resin composition of the present invention is a resin composition containing a bismaleimide compound (A) containing a constituent unit represented by the following formula (1), and maleimide groups at both ends of the molecular chain, at least one resin or compound (B) selected from the group consisting of a maleimide compound other than the bismaleimide compound (A), a cyanate compound, a benzoxazine compound, an epoxy resin, a carbodiimide compound, and a compound having an ethylenically unsaturated group, and a photo initiator (C) : wherein R1 represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms; R2 represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms; each R3 independently represents a hydrogen atom, a linear or branched alkyl group having 1 to 16 carbon atoms, or a linear or branched alkenyl group having 2 to 16 carbon atoms; and each n independently represents an integer of 1 to 10.