Bistable Display Electromagnetic Touch Integration
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Solution Overview
Problem
Conventional touch modes for portable electronic devices, such as capacitive and resistive touch, compromise the reflectivity of reflective-type bistable display devices when a sensing module is integrated, and the assembly of electromagnetic touch systems often results in errors and increased costs due to separate manufacturing and assembly processes.
Innovation Solution
A bistable display device design that integrates the display circuit on the upper surface and the electromagnetic sensing layer on the lower surface of a substrate, with a shielding and protection layer, allowing for improved flexibility, thinness, and reduced assembly errors and costs by forming these components directly on the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a capacitive or resistive sensing module is disposed on the display module, then touch sensing function is achieved, but the reflectivity is reduced and image display quality deteriorates
Solution Approach 1:
The patent replaces the traditional capacitive or resistive sensing modules with an electromagnetic sensing module that operates through electromagnetic field interaction. This substitution allows touch sensing functionality to be achieved without placing a physical sensing module on the display surface, thereby preserving the reflectivity and image display quality of the bistable display device.
2Ease of operation
If the electromagnetic sensing module is manufactured separately and assembled with the display module, then electromagnetic touch function is achieved, but assembly complexity increases and human error risks increase
Solution Approach 1:
The patent merges the electromagnetic sensing module with the display module by forming the electromagnetic sensing layer directly on the substrate during the display module manufacturing process. This integration eliminates the need for separate manufacturing and assembly operations, thereby reducing assembly complexity and minimizing human error risks while maintaining electromagnetic touch functionality.
3Adaptability or versatility
If separate design is employed for display module and electromagnetic sensing module, then functional independence is achieved, but manufacturing flexibility and thinness are reduced
Solution Approach 1:
The patent combines the display module and electromagnetic sensing module into a single integrated structure where the electromagnetic sensing layer is formed directly on the substrate during display module manufacturing. This merging approach maintains functional independence through separate functional regions while significantly reducing the overall device thickness by eliminating the need for separate module assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This integration enhances the flexibility and thinness of the display device while minimizing human error and assembly complexity, thereby reducing the overall assembly process and costs associated with electromagnetic touch systems.
Implementation Method 1
The electromagnetic sensing layer operatively has a magnetic field, and generates a magnetic field changing signal when the magnetic field changes.
Implementation Method 2
The display film is an image-displaying interface, and is operatively to change the magnetic field by user.
Data Source
AI summary
A bistable display device comprises a substrate, a display film, a display circuit, an electromagnetic sensing layer, a shielding layer and a protection layer. The substrate has an upper surface and a lower surface. The display film is disposed on the upper surface of the substrate. The display circuit is formed on the upper surface of the substrate. The electromagnetic sensing layer is formed on the lower surface of the substrate. The shielding layer is disposed under the electromagnetic sensing layer. The protecting layer is disposed under the shielding layer.