Bistatic LIDAR Transceiver Vertical Stacking for Crosstalk Reduction

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Solution Overview

Problem

Current lidar sensor systems face challenges in integrating a bistatic transceiver with other optical components at the chip level, leading to issues with electromagnetic interference and crosstalk due to the close spacing between the transmitter and receiver layers.

Innovation Solution

A bistatic transceiver is designed with a dual layer structure where the transmitter and receiver layers are stacked with an adhesive layer in between, decoupling high-power optical beams from low-power beams to mitigate interference, and using silicon photonics circuitry or III-V semiconductor circuitry to manage optical signals effectively.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If the transmitter and receiver layers are closely spaced to achieve compact integration, then device complexity is reduced, but electromagnetic interference and crosstalk increase

Engineering Contradiction:
Improveintegration complexityVSAvoidelectromagnetic interference
Core Design Contradiction:
Device complexityVSObject-affected harmful factors

Solution Approach 1:

The patent transitions from planar integration to three-dimensional stacking, placing transmitter and receiver layers in vertical proximity rather than horizontal adjacency. This dimensional change allows compact integration while maintaining spatial separation of optical paths, reducing electromagnetic interference and crosstalk between transmit and receive channels.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent divides the integrated circuit into separate transmitter and receiver layers, each with dedicated waveguides and optical components. This segmentation allows independent optimization of each layer's optical path and reduces cross-interference by confining high-power transmit signals to one layer and low-power receive signals to another layer.

Inventive Principle:
Principle #1Segmentation

2Manufacturing precision

If the transmitter and receiver layers are closely spaced to achieve compact integration, then manufacturing precision requirements are reduced, but signal interference increases

Engineering Contradiction:
Improvealignment precisionVSAvoidsignal integrity
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

By stacking layers vertically, the patent reduces the lateral alignment precision requirements compared to planar integration. The vertical separation creates distinct optical paths that are less sensitive to lateral misalignment, improving signal integrity while maintaining compact form factor.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent introduces intermediate coupling structures and isolation layers between transmitter and receiver layers. These intermediaries facilitate controlled optical coupling while providing electromagnetic isolation, ensuring signal integrity even with relaxed manufacturing tolerances.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Reliability

If the transmitter and receiver layers are separated to reduce interference, then signal integrity is improved, but device complexity increases

Engineering Contradiction:
Improvesignal integrityVSAvoidstructural complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent uses vertical stacking to achieve spatial separation of transmitter and receiver layers without increasing lateral footprint. This three-dimensional arrangement provides the benefits of separation (reduced interference) while maintaining compact integration, avoiding the complexity of separate housings or mechanical assemblies.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent combines multiple functions into the layered structure: optical transmission, signal reception, electromagnetic isolation, and mechanical support are all integrated into the stacked architecture. This merging reduces overall device complexity compared to separate components while maintaining signal integrity.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS20240230913A1Light detection and ranging (LIDAR) sensor system including bistatic transceiver
Publication Date: 2024.07.11 AURORA OPERATIONS INC
  • US20240230913A1 patent drawing
  • US20240230913A1 patent drawing
  • US20240230913A1 patent drawing

AI summary

A light detection and ranging (lidar) system for a vehicle may include a receiver layer, a transmitter layer coupled to the receiver layer through an adhesive layer in a first direction, and one or more optics. The transmitter layer may receive, at a first side of the transmitter layer, a transmit signal from a laser source, and transmit the transmit signal through the one or more optics. The receiver layer may receive, through the one or more optics, a return signal reflected by an object in an environment of the vehicle, and output the return signal at a first side of the receiver layer. The first side of the transmitter layer and the first side of the receiver layer may be apart from and parallel to each other in a second direction crossing the first direction.