Consecutive Bit Line Structure Across Active Layer Sidewalls
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Solution Overview
Problem
The difficulty in forming consecutive bit lines in semiconductor structures poses a challenge.
Innovation Solution
A semiconductor structure is designed with bit lines that cover the side surfaces of active layers and extend into them, forming a consecutive line through connections between first and second portions of the bit lines, using conductive structures to enhance reliability and signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional bit line formation methods are used, then manufacturing process is simpler, but bit lines cannot form a consecutive structure
Solution Approach 1:
The bit line is divided into two distinct portions: a first portion that covers the side surfaces of active layers, and a second portion that is located within the active layers. This segmentation allows each portion to be formed using different manufacturing approaches optimized for its specific requirements, enabling consecutiveness while managing manufacturing complexity.
Solution Approach 2:
The bit line structure transitions from a conventional single-plane configuration to a three-dimensional structure that wraps around and penetrates active layers. The first portion extends vertically to cover side surfaces, while the second portion extends horizontally within the active layer plane, creating a consecutive path through multiple spatial dimensions.
2Reliability
If bit lines are formed to cover side surfaces and extend into active layers, then signal transmission stability is improved, but device complexity increases
Solution Approach 1:
The bit line structure serves multiple functions simultaneously: the first portion provides electrical connection and signal transmission along the side surfaces of active layers, while the second portion provides additional electrical connection and signal transmission within the active layer plane. This multi-functionality improves signal transmission stability without requiring separate dedicated structures for each function.
Solution Approach 2:
The first portion and second portion of the bit line are merged into a single continuous conductive structure. This merging ensures electrical continuity and signal transmission stability by eliminating discontinuities that would occur with separate structures, while the integrated design manages complexity through unified formation processes.
Data Source
AI summary
A semiconductor structure includes: a substrate; a plurality of active layers arranged on the substrate and spaced apart from each other; and a plurality of bit lines, spaced apart from each other in a first direction and extending in a second direction. A first portion of each bit line covers side surfaces of respective active layers of the plurality of active layers, and a second portion of each bit line is located in the respective active layers. The first direction and the second direction are parallel to a surface of the substrate, and the first direction intersects with the second direction.