BJT Layout to Raise BVceo by Removing STI Between Emitters

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Solution Overview

Problem

The breakdown voltage of bipolar junction transistors (BJTs) is limited by the accumulation of phosphorus at the sidewalls of shallow trench isolation (STI) in the collector region, leading to a decrease in breakdown voltage BVceo, making it difficult to increase this voltage without reaching the minimum dose limitation of the ionized metal plasma (IMP) process.

Innovation Solution

Increasing the oxide diffusion (OD) area surrounding the emitter regions to create a larger distance between the emitter and STI regions, eliminating the STI cumulated phosphorus effect, and eliminating STI regions between emitter regions to enhance the breakdown voltage BVceo.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If ionized metal plasma (IMP) process is used to increase breakdown voltage, then breakdown voltage can be improved, but the dose limitation prevents further voltage increase

Engineering Contradiction:
Improvebreakdown voltageVSAvoidIMP dose
Core Design Contradiction:
StrengthVSQuantity of substance

Solution Approach 1:

The patent extracts and removes the STI regions from between the emitter regions, eliminating the source of phosphorus accumulation that limits breakdown voltage improvement through conventional IMP dosing

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent increases the oxide diffusion area in the horizontal plane surrounding each emitter region, creating additional separation distance between emitters and STI regions to reduce phosphorus accumulation effects

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Device complexity

If STI regions are present between emitter regions, then device structure is simplified, but phosphorus accumulates at STI sidewalls reducing breakdown voltage

Engineering Contradiction:
Improvedevice structureVSAvoidbreakdown voltage
Core Design Contradiction:
Device complexityVSStrength

Solution Approach 1:

The patent removes STI regions from between emitter regions, eliminating the harmful phosphorus accumulation sites at STI sidewalls while maintaining overall device structure

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent converts the harmful phosphorus accumulation effect into a benefit by increasing the oxide diffusion area, which creates a larger distance that prevents phosphorus accumulation and enhances breakdown voltage

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach increases the breakdown voltage BVceo of BJTs, preventing permanent damage from high voltage and rapidly increasing current, and allowing for higher voltage applications without the limitations of traditional IMP doses.

Implementation Method 1

Increasing the oxide diffusion (OD) area surrounding the emitter regions to create a larger distance between the emitter and STI regions, eliminating the STI cumulated phosphorus effect

Methodology Applied
Scientific EffectDiffusion: Diffusion

Data Source

PatentUS20240387650A1Bipolar junction transistor (BJT) and fabricating method thereof
Publication Date: 2024.11.21 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
  • US20240387650A1 patent drawing
  • US20240387650A1 patent drawing
  • US20240387650A1 patent drawing

AI summary

Methods for fabricating a bipolar junction transistor (BJT) are provided. A method includes forming a collector region, forming base regions over the collector region, and forming emitter regions over the base regions. The method further includes forming base dielectric layers over the collector region and on opposite sides of the base regions, forming base conductive layers over the base dielectric layers and on the opposite sides of the base regions, and forming base contacts over the base conductive layers. The top surface of the collector region is coplanar with bottom surfaces of the base regions and bottom surfaces of the base dielectric layers. The base contacts are divided into a first group of base contacts disposed between the base regions and a second group of base contacts disposed between the base regions and the STI region.