Black Matrix Double-Sided Exposure Adhesion

The patent applies double-sided exposure, transitioning from single-sided (one-dimensional) exposure to two-sided (two-dimensional) exposure. This allows light to penetrate the photoresist from both the upper and lower surfaces, creating uniform cross-linking throughout the thickness of the black matrix thin film. The result is a narrow line width black matrix that maintains strong adhesive force to the substrate, resolving the contradiction between achieving high pixel density through narrow line widths and preventing peeling through sufficient adhesive force.

By implementing double-sided exposure, the patent ensures uniform cross-linking density throughout the entire thickness of the black matrix thin film. This uniform cross-linking structure provides mechanical stability to the narrow line width black matrix, preventing deformation or collapse during subsequent preparation processes. The bidirectional light exposure creates a balanced internal structure that maintains the integrity of fine features while achieving the required manufacturing precision for high pixel density displays.

The patent introduces double-sided exposure, adding a second exposure dimension from the substrate side to complement the conventional upper-side exposure. This dual-directional approach creates uniform cross-linking throughout the photoresist thickness, ensuring consistent adhesion across the entire black matrix surface. While the process complexity increases slightly, the significant improvement in adhesive force and elimination of surface area difference make this trade-off worthwhile for achieving reliable high pixel density displays.