High-Modulus Black Matte Polyimide Film for Warpage Control
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Solution Overview
Problem
Conventional black matte polyimide films face issues with low modulus, excessive thermal expansion coefficient, and mechanical strength due to the use of organic matting particles, leading to warpage and reliability concerns in electronic components.
Innovation Solution
A high-modulus black matte polyimide film is developed using polyimide, carbon black, and liquid crystal polymer micropowder, which enhances modulus and reduces thermal expansion coefficient without compromising mechanical strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If organic matting particles (polyimide powder) are used to achieve matte appearance, then compatibility with polyimide substrate is improved, but mechanical strength decreases, modulus becomes low, and thermal expansion coefficient becomes excessive
Solution Approach 1:
The patent uses a composite matting system combining organic polyimide micropowder (5-15 wt%) for substrate compatibility and inorganic matting particles (15-30 wt%, such as silica or metal oxide) for mechanical strength and controlled thermal expansion. This composite approach resolves the contradiction by leveraging the complementary strengths of both material types.
Solution Approach 2:
The patent optimizes the weight ratios of different matting particles to control the thermal expansion coefficient. By adjusting the proportion of inorganic particles with low thermal expansion, the composite material achieves a balanced thermal expansion coefficient that reduces warpage while maintaining mechanical strength and matte appearance.
2Strength
If inorganic matting particles (silica or metal oxide powder) are used to improve mechanical strength and reduce thermal expansion coefficient, then modulus and thermal stability are improved, but compatibility with polyimide substrate deteriorates
Solution Approach 1:
The patent creates a composite matting system where inorganic particles provide mechanical strength and thermal stability, while polyimide micropowder ensures substrate compatibility. The synergistic combination resolves the compatibility issue while maintaining the mechanical benefits of inorganic particles.
Solution Approach 2:
The polyimide micropowder acts as an intermediary material that bridges the polyimide substrate and inorganic matting particles. It ensures good interfacial adhesion and compatibility while allowing the inorganic particles to provide their mechanical strengthening effect without direct adverse interaction with the substrate.
3Ease of manufacture
If high thermal expansion coefficient material is used, then ease of processing is improved, but warpage occurs after glue and copper adhesion due to thermal expansion mismatch
Solution Approach 1:
The patent modifies the thermal expansion coefficient parameter of the polyimide film by incorporating inorganic matting particles with low thermal expansion coefficients. This adjustment brings the film's thermal expansion closer to that of copper foil and adhesive, reducing thermal stress and preventing warpage during subsequent processing while maintaining manufacturability.
Data Source
AI summary
A high-modulus black matte polyimide film is provided, the high-modulus black matte polyimide film includes polyimide in an amount from 75 to 93 wt % of the high-modulus matte polyimide film, in which dianhydride and diamine are polymerized to form a polyimide precursor, and the polyimide precursor is chemically cyclized to form the polyimide; carbon black in an amount from 2 to 8 wt % of the high-modulus matte polyimide film; and liquid crystal polymer micropowder having a particle size between 2 and 10 μm and being in an amount from 5 to 20 wt % of the high-modulus matte polyimide film, wherein the high-modulus matte polyimide film has a gloss value at 60° being less than 50.