Grooved Black Wheel Air Release for Ultra-Thin Wafer Transfer

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Solution Overview

Problem

Ultra-thin silicon wafers experience bending and adherence issues during transportation due to strong absorption by black wheels, leading to failed transfer onto horizontal conveyor belts and potential damage.

Innovation Solution

The black wheel features grooves along its circumferential direction with compressed air lines within, blowing up the side of the wafer near the conveyor belt to facilitate separation and reduce adherence, using grooves and air lines to manage the transfer process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Force

If the black wheel has strong absorbability to hold the silicon wafer, then the wafer can be securely transported, but the wafer cannot be lifted off the wheel and transferred to the conveyor belt

Engineering Contradiction:

ImproveabsorbabilityVSAvoidtransfer ability

Core Design Contradiction:

ForceVSEase of operation

Solution Approach 1:

The black wheel surface is segmented into multiple grooves that divide the continuous adsorption surface into discrete sections. This segmentation allows compressed air to be applied locally to specific regions, enabling controlled release of the wafer from the wheel surface without compromising overall adsorption strength during transport.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Compressed air lines are integrated into the grooves of the black wheel to deliver pneumatic pressure directly to the interface between the wafer and wheel surface. This pneumatic action counteracts the adsorption force, creating a localized pressure field that lifts the wafer edge and enables transfer to the conveyor belt.

Inventive Principle:

Principle #29Pneumatics and hydraulics

2Manufacturing precision

If the silicon wafer is ultra-thin to meet manufacturing requirements, then processing precision is improved, but the wafer bends excessively during transportation

Engineering Contradiction:

Improvewafer thicknessVSAvoidbending degree

Core Design Contradiction:

Manufacturing precisionVSStability of the object's composition

Solution Approach 1:

The adsorption force exerted by the black wheel acts as a counterbalancing force against the gravitational and bending stresses on the ultra-thin wafer. By maintaining controlled adsorption during transport, the wafer is held flat and stable, counteracting the natural tendency of thin materials to bend or deform under their own weight.

Inventive Principle:

Principle #8Anti-weight (Counterweight)

Solution Approach 2:

The black wheel serves as an intermediary carrier between the vertical and horizontal transport systems. It provides a stable, controlled environment for holding and transporting ultra-thin wafers, protecting them from bending stresses while in transit, and then facilitating gentle transfer to the final destination.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Stability of the object's composition

If the wafer is closely attached to the black wheel surface, then transport stability is improved, but the side of the wafer cannot be lifted for transfer

Engineering Contradiction:

Improveattachment stabilityVSAvoidlift ability

Core Design Contradiction:

Stability of the object's compositionVSEase of operation

Solution Approach 1:

The grooves on the black wheel create local variations in surface properties, concentrating the compressed air delivery at specific locations (the groove regions). This localized application of pneumatic force targets only the necessary area for lift-off, maintaining stable attachment in other regions while enabling controlled release where needed.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively reduces adherence and bending, ensuring smooth transfer of ultra-thin wafers onto the conveyor belt, minimizing damage and enhancing processing efficiency.

Implementation Method 1

compressed air lines are respectively accommodated within the grooves and are configured to blow up a side of the ultra-thin silicon wafer close to the horizontal conveyor belt

Methodology Applied

Scientific EffectCompressed air: Pressure Gradient

Implementation Method 2

the silicon wafers are converted from a vertical state to a horizontal state by being absorbed by a black wheel one by one

Methodology Applied

Scientific EffectAbsorption: Absorption (physical)

Data Source

PatentUS12489008B2Black wheels for transporting ultra-thin silicon wafer

Publication Date: 2025.12.02 TIANJIN ZHONGHUAN SEMICON CO LTD

AI summary

A black wheel for transporting an ultra-thin silicon wafer may include grooves provided on a side surface of the black wheel along a circumferential direction of the black wheel. Compressed air lines are respectively accommodated within the grooves, and an air outlet of each of the compressed air lines is provided to align with a side of the ultra-thin silicon wafer close to a next process device.