Blackening Composition for Copper and Silver Metal Circuits

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Solution Overview

Problem

Current methods for blackening copper and silver-based metal circuits in display devices, such as touch panels and liquid crystal displays, fail to sufficiently reduce reflectance while maintaining smoothness, leading to reduced display accuracy and appearance.

Innovation Solution

An aqueous solution containing water-soluble metal compounds like palladium, ruthenium, or silver, combined with halides and nitrogen-containing compounds like alkylene diamines or polyamide polyamines, is used to blacken copper or silver-based metals, reducing reflectance without impairing smoothness.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If hypochlorite or chlorite is used to oxidize copper surface for blackening treatment, then adhesion between copper surface and prepreg resin is improved, but the degree of blackening is insufficient and reflectance is not sufficiently reduced

Engineering Contradiction:
Improveadhesion between copper surface and prepreg resinVSAvoidreflectance of copper circuit
Core Design Contradiction:
StrengthVSObject-affected harmful factors

Solution Approach 1:

The invention changes the chemical parameters of the blackening solution by combining multiple agents (hypochlorite/chlorite oxidizing agent, stabilizing agent, and光亮 agent) in specific concentrations and ratios. This parameter optimization enables simultaneous achievement of sufficient blackening degree and maintained surface smoothness, resolving the contradiction between adhesion improvement and reflectance reduction.

Inventive Principle:
Principle #35Parameter changes

2Object-affected harmful factors

If aqueous sulfide solution is used for blackening copper surface, then blackening effect is achieved, but the surface and side of copper circuit are roughened and wiring accuracy is reduced

Engineering Contradiction:
Improvereflectance of copper circuitVSAvoidwiring accuracy
Core Design Contradiction:
Object-affected harmful factorsVSManufacturing precision

Solution Approach 1:

The invention introduces a stabilizing agent as an intermediary substance that mediates between the oxidizing agent and the copper surface. This stabilizing agent controls the oxidation reaction to produce fine, uniform copper oxide particles that blacken the surface without causing roughness, thereby maintaining wiring accuracy while achieving sufficient blackening effect.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The blackening solution is formulated as a composite system containing multiple chemical components (oxidizing agent, stabilizing agent,光亮 agent) that work synergistically. This composite approach replaces the simple sulfide solution, achieving both reflectance reduction and surface smoothness preservation through the combined effects of the different agents.

Inventive Principle:
Principle #40Composite materials

3Object-affected harmful factors

If conventional blackening methods are used on silver paste circuits, then blackening is achieved, but surface smoothness is impaired

Engineering Contradiction:
Improvereflectance of silver conductor partVSAvoidsmoothness of silver paste surface
Core Design Contradiction:
Object-affected harmful factorsVSShape

Solution Approach 1:

The invention optimizes the chemical parameters of the blackening solution specifically for silver paste substrates by adjusting the types and concentrations of oxidizing agents, stabilizing agents, and光亮 agents. These parameter changes enable controlled formation of fine black oxide layers on silver surfaces without disrupting the underlying paste matrix structure, thus maintaining surface smoothness while achieving reflectance reduction.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively reduces reflectance and enhances the decorative appearance of copper and silver-based metal circuits, maintaining their smoothness and improving display accuracy.

Implementation Method 1

when an article containing a copper-based metal, such as copper or a copper alloy, or an article containing a silver-based metal, such as silver or a silver alloy, is treated with an aqueous solution containing at least one water-soluble metal compound selected from the group consisting of water-soluble palladium compounds, water-soluble ruthenium compounds, and water-soluble silver compounds

Methodology Applied
Scientific EffectChemical reaction: Chemical Bonding

Implementation Method 2

further containing a halide and a specific compound containing a nitrogen atom, the copper-based metal or the silver-based metal can be sufficiently blackened to reduce the reflectance and improve the decorativeness, without impairing the smoothness

Methodology Applied
Scientific EffectChemical reaction: Chemical Bonding

Data Source

PatentUS10184186B2Composition for blackening copper-based or silver-based metals
Publication Date: 2019.01.22 OKUNO CHEM IND CO LTD
  • US10184186B2 patent drawing
  • US10184186B2 patent drawing

AI summary

An object is to provide a novel composition for blackening treatment that can sufficiently blacken copper circuits of printed wiring boards, circuits made of silver paste, and other various articles containing a copper-based metal, such as copper or a copper alloy, or a silver-based metal, such as silver or a silver alloy, without impairing the smoothness of the copper-based metal or silver-based metal. A composition is provided for blackening treatment of a copper-based metal or a silver-based metal, the composition comprising an aqueous solution containing:(i) at least one water-soluble metal compound selected from the group consisting of water-soluble palladium compounds, water-soluble ruthenium compounds, and water-soluble silver compounds;(ii) at least one halide selected from the group consisting of hydrohalic acids, metal halides, and ammonium halides; and(iii) at least one nitrogen atom-containing compound selected from the group consisting of alkylene diamines, polyalkylene polyamines, polyamide polyamines, and crosslinked polyamide polyamines.