Bladder System for Thin Die Ejection from Tape
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Solution Overview
Problem
The challenge lies in efficiently removing semiconductor devices with thicknesses under 50 microns from tape without damaging them, as conventional methods struggle to separate these fragile devices without causing damage.
Innovation Solution
A bladder system is positioned between the tape and an adhesive layer, featuring selectively expandable chambers that move the adhesive layer away from the tape, allowing for the safe removal of semiconductor devices by providing a non-contact separation mechanism using fluid expansion through conduits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If conventional mechanical removal methods are used on thin semiconductor devices, then the devices can be removed from tape, but the devices may be damaged due to mechanical stress
Solution Approach 1:
A bladder is introduced as an intermediary element between the tape and the semiconductor device. The bladder can be expanded to lift the device away from the tape without direct mechanical contact between removal tools and the fragile device, thus preventing damage while enabling removal
Solution Approach 2:
The bladder is inflated using gas or fluid pressure to create a cushioning effect between the removal mechanism and the semiconductor device. This pneumatic/hydraulic approach replaces direct mechanical force with distributed pressure, allowing safe handling of thin devices under 50 microns thick
2Volume of moving object
If the thickness of semiconductor devices is reduced to minimize size, then the footprint is reduced, but the devices become more fragile and difficult to remove from tape
Solution Approach 1:
The bladder is positioned and prepared in advance before the removal process begins. When needed, it can be rapidly inflated to provide immediate cushioning protection to the fragile thin device, preventing mechanical stress during the critical removal moment
Solution Approach 2:
The system changes the physical state of the bladder from a collapsed low-volume state to an expanded high-volume state by introducing gas or fluid pressure. This parameter change allows the bladder to adapt its volume and shape to accommodate devices of varying thicknesses while maintaining protective contact
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables the effective removal of semiconductor devices from tape without damage, even for devices with minimal thickness, by creating space between the device and the tape, thus preventing mechanical stress and potential breakage.
Implementation Method 1
The chambers may be selectively expanded to move a portion of the bladder and adhesive layer away from the tape
Data Source
AI summary
An apparatus, system, and a method of using the apparatus or system that includes a bladder positioned between tape and an adhesive layer configured to selectively connect the tape to a semiconductor device. The bladder includes one or more chambers that may be selectively expanded to move a portion of the bladder and adhesive layer away from the tape, which may enable the removal of the semiconductor device. The flow of fluid into each of the chambers may selectively expand the chambers. The chambers may have a substantially rounded upper profile or a substantially pointed upper profile. A material within the chambers may be heated to expand the chambers. A plurality of conduits may permit the flow of fluid into the chambers. The conduits may be inserted into the bladder. The chambers may be collapsed after expansion to enable the removal of a semiconductor device from the tape.